Microembossing of ultrafine grained Al: microstructural analysis and finite element modelling

Qiao, Xiao Guang, Bah, Mamadou T., Zhang, Jiuwen, Gao, Nong, Moktadir, Zakaria, Kraft, Michael and Starink, Marco J. (2010) Microembossing of ultrafine grained Al: microstructural analysis and finite element modelling. Journal of Micromechanics and Microengineering, 20, (10), 105002-[15pp]. (doi:10.1088/0960-1317/20/10/105002).


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Ultra fine grained (UFG) Al-1050 processed by equal channel angular pressing (ECAP) and UFG Al-Mg-Cu-Mn processed by high pressure torsion (HPT) were embossed at both room temperature and 300 ?C, with the aim of producing micro-channels. The behaviour of Al alloys during the embossing process was analysed using finite element (FE) modelling. The cold embossing of both Al alloys is characterised by a partial pattern transfer, a large embossing force, channels with oblique sidewalls and a large failure rate of the mould. The hot embossing is characterised by straight channel sidewalls, fully transferred patterns and reduced loads which decrease the failure rate of the mould. Hot embossing of UFG Al-Mg-Cu-Mn produced by HPT shows a potential of fabrication of microelectromechanical system (MEMS) components with micro channels.

Item Type: Article
Digital Object Identifier (DOI): doi:10.1088/0960-1317/20/10/105002
ISSNs: 0960-1317 (print)
1361-6439 (electronic)
Subjects: T Technology > TN Mining engineering. Metallurgy
Divisions : University Structure - Pre August 2011 > School of Electronics and Computer Science
University Structure - Pre August 2011 > School of Engineering Sciences > Engineering Materials & Surface Engineering
ePrint ID: 163079
Accepted Date and Publication Date:
5 March 2010Submitted
19 July 2010In press
1 September 2010Published
Date Deposited: 03 Sep 2010 08:02
Last Modified: 31 Mar 2016 13:29
Funded by: EPSRC (EP/D00313X/1)
Led by: Nong Gao
1 August 2006 to 31 October 2009
URI: http://eprints.soton.ac.uk/id/eprint/163079

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