Extrusion freeforming of millimeter wave electromagnetic bandgap (EBG) structures
Lu, Xuesong, Lee, Yoonjae, Yang, Shoufeng, Hao, Yang, Evans, Julian and Parini, Clive (2009) Extrusion freeforming of millimeter wave electromagnetic bandgap (EBG) structures. Rapid Prototyping Journal, 15, (1), 42-51. (doi:10.1108/13552540910925054).
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Purpose – The aim of this paper is to provide an easy method of extrusion freeforming to fabricate microwave electromagnetic bandgap (EBG) crystals. EBG crystals are periodic dielectric structures that can block wave propagation and generate a bandgap. These crystals can be used in high capability antennae, electromagnetic wave semiconductors, microresonators, high-reflectivity mirrors and polarizing beam splitters.
Design/methodology/approach – The effects of extrusion process parameters and paste characteristics were investigated. Finally, one-period and two-period woodpile EBG crystals with bandgaps in the frequency region of 90-110?GHz were fabricated and the bandgap was measured.
Findings – The filament diameter is influenced by whether extrusion is carried out with or without a substrate and by the free fall-distance from the nozzle. The quality of lattice structures is dependent on paste flow and properties. A ceramic paste with 60?vol.?% (the fraction of ceramic powder based on solvent-free polymer) was well suited to fabrication. The solvent content also influenced the fabrication. The experimental results show that under ~12 per cent solvent mass fraction in the paste and relatively high extrusion ram velocity (more than 0.014?mm/s) at a pressure of 14?MPa, samples with high quality were fabricated.
Originality/value – This paper demonstrates that the rapid prototyping method of extrusion freeforming can be applied for the fabrication of EBG crystals from ceramic powders and the important factors which influence the product quality are identified.
|Digital Object Identifier (DOI):||doi:10.1108/13552540910925054|
|Keywords:||rapid prototypes, ceramics, crystal structure, modelling|
|Subjects:||T Technology > TS Manufactures
T Technology > TP Chemical technology
T Technology > TK Electrical engineering. Electronics Nuclear engineering
|Divisions :||University Structure - Pre August 2011 > School of Engineering Sciences > Engineering Materials & Surface Engineering
|Accepted Date and Publication Date:||
|Date Deposited:||07 Oct 2010 13:46|
|Last Modified:||31 Mar 2016 13:29|
|RDF:||RDF+N-Triples, RDF+N3, RDF+XML, Browse.|
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