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Board-level vibration failure criteria for printed circuit assemblies: an experimental approach

Board-level vibration failure criteria for printed circuit assemblies: an experimental approach
Board-level vibration failure criteria for printed circuit assemblies: an experimental approach
This paper presents a method to predict the reliability of electronic components subjected to intense vibration. A range of discrete SMT package types were experimentally tested, including resistors, transistors, capacitors and SOIC packages, failure was detected in real-time. Important results from this paper are that local PCB curvature strongly correlates with failure rates, whilst local PCB acceleration has no correlation. The method and findings shown in this paper are essential reading for anyone considering creating their own failure test.
components, components screening, failure criteria, printed circuit board (pcb) vibrations, testing, vibration endurance, vibration failure, PCB, electronic
1521-334X
Amy, R.A.
9d23cdc5-0725-46ba-88d3-cd746fd3b37a
Aglietti, G.S.
e44d0dd4-0f71-4399-93d2-b802365cfb9e
Richardson, Guy
b55f5727-de16-4e7e-8b98-9f0ab3a6a414
Amy, R.A.
9d23cdc5-0725-46ba-88d3-cd746fd3b37a
Aglietti, G.S.
e44d0dd4-0f71-4399-93d2-b802365cfb9e
Richardson, Guy
b55f5727-de16-4e7e-8b98-9f0ab3a6a414

Amy, R.A., Aglietti, G.S. and Richardson, Guy (2010) Board-level vibration failure criteria for printed circuit assemblies: an experimental approach. IEEE Transactions on Electronics Packaging Manufacturing, 33 (Issue 4). (doi:10.1109/TEPM.2010.2084092).

Record type: Article

Abstract

This paper presents a method to predict the reliability of electronic components subjected to intense vibration. A range of discrete SMT package types were experimentally tested, including resistors, transistors, capacitors and SOIC packages, failure was detected in real-time. Important results from this paper are that local PCB curvature strongly correlates with failure rates, whilst local PCB acceleration has no correlation. The method and findings shown in this paper are essential reading for anyone considering creating their own failure test.

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More information

Published date: 28 October 2010
Keywords: components, components screening, failure criteria, printed circuit board (pcb) vibrations, testing, vibration endurance, vibration failure, PCB, electronic

Identifiers

Local EPrints ID: 167853
URI: http://eprints.soton.ac.uk/id/eprint/167853
ISSN: 1521-334X
PURE UUID: 906d0ebd-f795-46cd-ac7f-df29e8d1608f

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Date deposited: 19 Nov 2010 09:23
Last modified: 14 Mar 2024 02:17

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Contributors

Author: R.A. Amy
Author: G.S. Aglietti
Author: Guy Richardson

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