Modeling of modulus graded axisymmetric adhesive joints

Abstract

This study presents a refined theoretical framework for the stress analysis of modulus graded axisymmetric adhesive joints which takes into account the radial stresses in the bonded assembly. This semi-analytical is based on a variational method which minimizes the complementary energy of the bonded system. The joint consists of similar or dissimilar polar anisotropic composite adherends or metallic adherends and a functionally modulus graded bondline (FMGB) adhesive. The elastic modulus of the adhesive is functionally graded along the bondlength by assuming smooth modulus profiles which reflect the behavior of practically producible graded bondline. The stress distribution predicted by this refined model is compared with that of MMB model which also accounts for in the bonded system to estimate reduction in shear and peel stress peaks in the bondline. The axisymmetric stress analysis reveals that the peel and shear stress peaks in the FMGB are much smaller and the stress distribution is more uniform along its length than those of mono-modulus bondline (MMB) adhesive joints under the same axial tensile load. A systematic parametric study has been conducted by selectively perturbing the material and geometrical properties of the joint in order to study their influence on
stress distribution in the bondline. Furthermore, the results suggest that the peel and shear strengths can be optimized by spatially controlling the modulus of the
adhesive.

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