On interface stiffness graded axisymmetric adhesive joints

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Description/Abstract

An improved analytical framework is presented for the stress analysis of interface
stiffness graded axisymmetric adhesive joints. The governing integrodifferential
equation of the problem is obtained through a variational method
which minimizes the complementary energy of the bonded assembly. The
joint is composed of similar or dissimilar polar anisotropic and/or isotropic
adherends and a functionally modulus graded bondline (FMGB) adhesive.
The elastic modulus of the adhesive is functionally graded along the bondlength
by assuming smooth modulus profiles which reflect the behavior of practically
producible graded bondline. Influence of non-zero radial stresses in the
bonded system on shear and peel stresses is evaluated. The stress distribution
predicted by this refined model is compared with that of mono-modulus
bondline (MMB) model for the same axial tensile load in order to estimate
reduction in shear and peel stress peaks in the bondline and the adherends.
A systematic parametric study indicates that an optimum joint strength can
be achieved by employing a stiffness graded bondline with an appropriate
combination of geometrical and material properties of the adherends. This
model can also be applied to examine the effects of loss of interface stiffness
due to an existing defect and/or damage in the bondline.