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Packaging of structural health monitoring components

Packaging of structural health monitoring components
Packaging of structural health monitoring components
Structural Health Monitoring (SHM) technologies have the potential to realize economic benefits in a broad range of commercial and defense markets. Previous research conducted by Metis Design and MIT has demonstrated the ability of Lamb waves methods to provide reliable information regarding the presence, location and type of damage in composite specimens. The present NSF funded program was aimed to study manufacturing, packaging and interface concepts for critical SHM components. The intention is to be able to cheaply manufacture robust actuating/sensing devices, and isolate them from harsh operating environments including natural, mechanical, or electrical extremes. Currently the issues related to SHM system durability have remained undressed. During the course of this research several sets of test devices were fabricated and packaged to protect the piezoelectric component assemblies for robust operation. These assemblies were then tested in hot and wet conditions, as well as in electrically noisy environments. Future work will aim to package the other supporting components such as the battery and wireless chip, as well as integrating all of these components together for operation. SHM technology will enable the reduction or complete elimination of scheduled inspections, and will allow condition-based maintenance for increased reliability and reduced overall life-cycle costs.
0819453080
219-229
SPIE - The International Society for Optical Engineering
Kessler, Seth S.
20a4d107-0f18-4c32-a684-18d83ce9570f
Spearing, S.Mark
9e56a7b3-e0e8-47b1-a6b4-db676ed3c17a
Dunn, Christopher T.
948fe093-9296-43e3-9525-91ee9b8e5dc9
Liu, Shih-Chi
Kessler, Seth S.
20a4d107-0f18-4c32-a684-18d83ce9570f
Spearing, S.Mark
9e56a7b3-e0e8-47b1-a6b4-db676ed3c17a
Dunn, Christopher T.
948fe093-9296-43e3-9525-91ee9b8e5dc9
Liu, Shih-Chi

Kessler, Seth S., Spearing, S.Mark and Dunn, Christopher T. (2004) Packaging of structural health monitoring components. Liu, Shih-Chi (ed.) In Smart Structures and Materials 2004: Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems. vol. 5391, SPIE - The International Society for Optical Engineering. pp. 219-229 . (doi:10.1117/12.538843).

Record type: Conference or Workshop Item (Paper)

Abstract

Structural Health Monitoring (SHM) technologies have the potential to realize economic benefits in a broad range of commercial and defense markets. Previous research conducted by Metis Design and MIT has demonstrated the ability of Lamb waves methods to provide reliable information regarding the presence, location and type of damage in composite specimens. The present NSF funded program was aimed to study manufacturing, packaging and interface concepts for critical SHM components. The intention is to be able to cheaply manufacture robust actuating/sensing devices, and isolate them from harsh operating environments including natural, mechanical, or electrical extremes. Currently the issues related to SHM system durability have remained undressed. During the course of this research several sets of test devices were fabricated and packaged to protect the piezoelectric component assemblies for robust operation. These assemblies were then tested in hot and wet conditions, as well as in electrically noisy environments. Future work will aim to package the other supporting components such as the battery and wireless chip, as well as integrating all of these components together for operation. SHM technology will enable the reduction or complete elimination of scheduled inspections, and will allow condition-based maintenance for increased reliability and reduced overall life-cycle costs.

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More information

Published date: 2004
Venue - Dates: Smart Structures and Materials 2004: Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems, San Diego, USA, 2004-03-15 - 2004-03-15

Identifiers

Local EPrints ID: 23279
URI: http://eprints.soton.ac.uk/id/eprint/23279
ISBN: 0819453080
PURE UUID: fb499fa1-9a5f-4106-b620-1193cb43ae59
ORCID for S.Mark Spearing: ORCID iD orcid.org/0000-0002-3059-2014

Catalogue record

Date deposited: 13 Mar 2006
Last modified: 16 Mar 2024 03:37

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Contributors

Author: Seth S. Kessler
Author: S.Mark Spearing ORCID iD
Author: Christopher T. Dunn
Editor: Shih-Chi Liu

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