Dynamic Electrical-Magnetic-Thermal Simulation of Magnetic Components
Dynamic Electrical-Magnetic-Thermal Simulation of Magnetic Components
This paper describes how the modeling and simulation of electro-magnetic devices can be extended to include dynamic thermal effects. The power generated by hysteresis inside ferrite cores is connected to a thermal model of the core material. The thermal conduction of the core material is modeled as is the convection of thermal energy from the core to the surrounding environment. The effective temperature change inside the core is used to modify the parameters of the core material model to accurately reflect the dynamic performance of the device at all temperatures. The electrical circuit, magnetic material and thermal networks are all modeled concurrently in the time domain to allow dynamic interactions across all three domains.
286-291
Wilson, P.R.
8a65c092-c197-4f43-b8fc-e12977783cb3
Ross, J.N.
6e400bb6-f2bc-4ca0-8b93-c7428a42c03b
Brown, A.D.
5c19e523-65ec-499b-9e7c-91522017d7e0
July 2000
Wilson, P.R.
8a65c092-c197-4f43-b8fc-e12977783cb3
Ross, J.N.
6e400bb6-f2bc-4ca0-8b93-c7428a42c03b
Brown, A.D.
5c19e523-65ec-499b-9e7c-91522017d7e0
Wilson, P.R., Ross, J.N. and Brown, A.D.
(2000)
Dynamic Electrical-Magnetic-Thermal Simulation of Magnetic Components.
IEEE Workshop on Computers in Power Electronics, Blacksburg, Va., United States.
.
Record type:
Conference or Workshop Item
(Paper)
Abstract
This paper describes how the modeling and simulation of electro-magnetic devices can be extended to include dynamic thermal effects. The power generated by hysteresis inside ferrite cores is connected to a thermal model of the core material. The thermal conduction of the core material is modeled as is the convection of thermal energy from the core to the surrounding environment. The effective temperature change inside the core is used to modify the parameters of the core material model to accurately reflect the dynamic performance of the device at all temperatures. The electrical circuit, magnetic material and thermal networks are all modeled concurrently in the time domain to allow dynamic interactions across all three domains.
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More information
Published date: July 2000
Additional Information:
IEEE Workshop on Computers in Power Electronics (COMPEL) Virginia Tech, Blacksburg, Va, USA Event Dates: 2000 Organisation: IEEE 7th Workshop on Computers in Power Electronics
Venue - Dates:
IEEE Workshop on Computers in Power Electronics, Blacksburg, Va., United States, 2000-01-01
Organisations:
EEE
Identifiers
Local EPrints ID: 255718
URI: http://eprints.soton.ac.uk/id/eprint/255718
PURE UUID: d034a2b0-3b28-44a3-92f9-f4175fdbf49f
Catalogue record
Date deposited: 04 Jun 2001
Last modified: 08 Jan 2022 14:41
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Contributors
Author:
P.R. Wilson
Author:
J.N. Ross
Author:
A.D. Brown
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