Bonding Wire Discharges in Integrated Circuit Packages
Hughes, J.F., Crockett, R.G.M., Pude, J. and Singh, S. (1985) Bonding Wire Discharges in Integrated Circuit Packages. Journal of Electrostatics, 16, (243), 343-52.
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| Item Type: | Article |
|---|---|
| Divisions: | Faculty of Physical Sciences and Engineering > Electronics and Computer Science |
| Item ID: | 255806 |
| Date Deposited: | 09 May 2001 |
| Last Modified: | 02 Mar 2012 12:39 |
| Contributors: | Hughes, J.F. (Author) Crockett, R.G.M. (Author) Pude, J. (Author) Singh, S. (Author) |
| Date: | 1985 |
| Status: | Published |
| Publisher: | Elsevier |
| Further Information: | Google Scholar |
| ISI Citation Count: | 3 |
| URI: | http://eprints.soton.ac.uk/id/eprint/255806 |
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