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Positive and Negative Photoresist as Thick Moulds for Electroplating High Aspect Ratio 3D Structures

Positive and Negative Photoresist as Thick Moulds for Electroplating High Aspect Ratio 3D Structures
Positive and Negative Photoresist as Thick Moulds for Electroplating High Aspect Ratio 3D Structures
High aspect ratio 3D structures for use as magnetic actuators.
Elejalde, N.
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Grigore, L.
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Ensell, G. J.
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Evans, A. G. R.
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Lee, S. L.
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Ogrin, F. Y.
213a9a38-6afd-4df6-b054-5e4afeec5eec
Lee, M. A.
efca3f39-fb13-4856-91b0-1b1fa9082d30
Elejalde, N.
76c8c340-722e-49dc-8298-2c1a8db07fde
Grigore, L.
15f32968-e43a-4a58-979d-9b88eb196ce6
Ensell, G. J.
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Evans, A. G. R.
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Lee, S. L.
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Ogrin, F. Y.
213a9a38-6afd-4df6-b054-5e4afeec5eec
Lee, M. A.
efca3f39-fb13-4856-91b0-1b1fa9082d30

Elejalde, N., Grigore, L., Ensell, G. J., Evans, A. G. R., Lee, S. L., Ogrin, F. Y. and Lee, M. A. (2001) Positive and Negative Photoresist as Thick Moulds for Electroplating High Aspect Ratio 3D Structures.

Record type: Other

Abstract

High aspect ratio 3D structures for use as magnetic actuators.

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More information

Published date: 2001
Additional Information: Organisation: University of St. Andrews
Organisations: Nanoelectronics and Nanotechnology

Identifiers

Local EPrints ID: 256171
URI: http://eprints.soton.ac.uk/id/eprint/256171
PURE UUID: 4ffc53d5-22bf-42b9-8bf5-cdfeb6a43fd2

Catalogue record

Date deposited: 11 Dec 2001
Last modified: 10 Dec 2021 20:42

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Contributors

Author: N. Elejalde
Author: L. Grigore
Author: G. J. Ensell
Author: A. G. R. Evans
Author: S. L. Lee
Author: F. Y. Ogrin
Author: M. A. Lee

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