On optimisation of Nickel Electroforming for MEMS applications
On optimisation of Nickel Electroforming for MEMS applications
This paper presents the details of an optimum nickel electroforming process for MEMS applications. Electrochemical deposition of nickel microstructures in thick resist moulds from a standard process using a sulphamate electrlyte gives most of the time poor quality deposits: non uniform, sometimes with pitting and without adherence on the substrate. As in MEMS devices the features to be electroplated are of micron size (which creates a big disproportion in the surface area between the two electrodes involved in the plating bath), an optimisation of the standard electroplating rocess was developed.
thick resist mould, sulphamate electroplating bath, nickel microstructures
83-86
Grigore, L
b77afed2-6b2a-4d37-a69b-59e447a5541a
Ensell, GJ
846af5f5-7a0b-44e5-86aa-195c528e4d22
Evans, AGR
90deb811-a6d6-47f9-8635-eb1df3649552
Elejalde, N
1a49ffab-0279-4be5-af69-8df46d02d881
Lee, S
a9e008ca-6a12-4dd7-bdcb-bc4f705ac441
2002
Grigore, L
b77afed2-6b2a-4d37-a69b-59e447a5541a
Ensell, GJ
846af5f5-7a0b-44e5-86aa-195c528e4d22
Evans, AGR
90deb811-a6d6-47f9-8635-eb1df3649552
Elejalde, N
1a49ffab-0279-4be5-af69-8df46d02d881
Lee, S
a9e008ca-6a12-4dd7-bdcb-bc4f705ac441
Grigore, L, Ensell, GJ, Evans, AGR, Elejalde, N and Lee, S
(2002)
On optimisation of Nickel Electroforming for MEMS applications.
Micromechanics Europe 2002, Sinaia, Romania.
05 - 07 Oct 2002.
.
Record type:
Conference or Workshop Item
(Paper)
Abstract
This paper presents the details of an optimum nickel electroforming process for MEMS applications. Electrochemical deposition of nickel microstructures in thick resist moulds from a standard process using a sulphamate electrlyte gives most of the time poor quality deposits: non uniform, sometimes with pitting and without adherence on the substrate. As in MEMS devices the features to be electroplated are of micron size (which creates a big disproportion in the surface area between the two electrodes involved in the plating bath), an optimisation of the standard electroplating rocess was developed.
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More information
Published date: 2002
Additional Information:
Event Dates: 6th-8th October 2002
Venue - Dates:
Micromechanics Europe 2002, Sinaia, Romania, 2002-10-05 - 2002-10-07
Keywords:
thick resist mould, sulphamate electroplating bath, nickel microstructures
Organisations:
Nanoelectronics and Nanotechnology
Identifiers
Local EPrints ID: 257591
URI: http://eprints.soton.ac.uk/id/eprint/257591
PURE UUID: 1791a503-3cdf-4d98-a296-873a60764e16
Catalogue record
Date deposited: 26 Aug 2004
Last modified: 15 Dec 2021 17:48
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Contributors
Author:
L Grigore
Author:
GJ Ensell
Author:
AGR Evans
Author:
N Elejalde
Author:
S Lee
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