On optimisation of Nickel electroforming for MEMS applications
Grigore, L, Ensell, GJ, Evans, AGR, Elejalde, N and Lee, S (2002) On optimisation of Nickel electroforming for MEMS applications. In, Micromechanics Europe, Sinaia, Romania, 08 - 06 Oct 2002. , 83-86.
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Description/Abstract
This paper presents the details of an optimum nickel electroforming process for MEMS applications. Electrochemical deposition of nickel microstructures in thick resist moulds from a standard process using a sulphamate electrlyte gives most of the time poor quality deposits: non uniform, sometimes with pitting and without adherence on the substrate. As in MEMS devices the features to be electroplated are of micron size (which creates a big disproportion in the surface area between the two electrodes involved in the plating bath), an optimisation of the standard electroplating rocess was developed.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Additional Information: | Event Dates: October 6-8th 2002 |
| Keywords: | thick resist mould, sulphamate electroplating bath, nickel microstructures |
| Divisions: | Faculty of Physical and Applied Science > Electronics and Computer Science > NANO |
| Item ID: | 257591 |
| Date Deposited: | 26 Aug 2004 |
| Last Modified: | 02 Mar 2012 12:20 |
| Contributors: | Grigore, L (Author) Ensell, GJ (Author) Evans, AGR (Author) Elejalde, N (Author) Lee, S (Author) |
| Date: | 2002 |
| Additional Information: | Event Dates: October 6-8th 2002 |
| Status: | Published |
| Further Information: | Google Scholar |
| URI: | http://eprints.soton.ac.uk/id/eprint/257591 |
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