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Test data compression: The system integrator’s perspective

Test data compression: The system integrator’s perspective
Test data compression: The system integrator’s perspective
Test data compression (TDC) is a promising low-cost methodology for System-on-a-Chip (SOC) test. This is due to the fact that it can reduce not only the volume of test data but also the bandwidth requirements. In this paper we provide a quantitative analysis of two distinctive TDC methods from the system integrator’s standpoint considering a core based SOC environment. The proposed analysis addresses four parameters: compression ratio, test application time, area overhead and power dissipation. Based on our analysis, some future research directions are given which can lead to an easier integration of TDC in the SOC design flow and to further improve the four parameters.
726-731
Gonciari, Paul Theo
a7b9003b-b7d9-4ae6-8164-d878a0b59e43
Al-Hashimi, Bashir
0b29c671-a6d2-459c-af68-c4614dce3b5d
Nicolici, Nicola
61efa5a6-7da8-4c33-8e68-2679a9bb0871
Gonciari, Paul Theo
a7b9003b-b7d9-4ae6-8164-d878a0b59e43
Al-Hashimi, Bashir
0b29c671-a6d2-459c-af68-c4614dce3b5d
Nicolici, Nicola
61efa5a6-7da8-4c33-8e68-2679a9bb0871

Gonciari, Paul Theo, Al-Hashimi, Bashir and Nicolici, Nicola (2003) Test data compression: The system integrator’s perspective. Design Automation and Test in Europe, , Munich, Germany. 03 - 07 Mar 2003. pp. 726-731 .

Record type: Conference or Workshop Item (Paper)

Abstract

Test data compression (TDC) is a promising low-cost methodology for System-on-a-Chip (SOC) test. This is due to the fact that it can reduce not only the volume of test data but also the bandwidth requirements. In this paper we provide a quantitative analysis of two distinctive TDC methods from the system integrator’s standpoint considering a core based SOC environment. The proposed analysis addresses four parameters: compression ratio, test application time, area overhead and power dissipation. Based on our analysis, some future research directions are given which can lead to an easier integration of TDC in the SOC design flow and to further improve the four parameters.

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More information

Published date: 2003
Additional Information: Event Dates: 3-7 March, 2003
Venue - Dates: Design Automation and Test in Europe, , Munich, Germany, 2003-03-03 - 2003-03-07

Identifiers

Local EPrints ID: 258320
URI: http://eprints.soton.ac.uk/id/eprint/258320
PURE UUID: 1e4849bd-6ec5-4e90-9d76-0822292d4c19

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Date deposited: 07 Oct 2003
Last modified: 14 Mar 2024 06:07

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Contributors

Author: Paul Theo Gonciari
Author: Bashir Al-Hashimi
Author: Nicola Nicolici

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