Test Data Compression: The System Integrator’s Perspective


Gonciari, Paul Theo, Al-Hashimi, Bashir and Nicolici, Nicola (2003) Test Data Compression: The System Integrator’s Perspective. In, Design Automation and Test in Europe, Munich, Germany, 03 - 07 Mar 2003. IEEE, 726-731.

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Description/Abstract

Test data compression (TDC) is a promising low-cost methodology for System-on-a-Chip (SOC) test. This is due to the fact that it can reduce not only the volume of test data but also the bandwidth requirements. In this paper we provide a quantitative analysis of two distinctive TDC methods from the system integrator’s standpoint considering a core based SOC environment. The proposed analysis addresses four parameters: compression ratio, test application time, area overhead and power dissipation. Based on our analysis, some future research directions are given which can lead to an easier integration of TDC in the SOC design flow and to further improve the four parameters.

Item Type: Conference or Workshop Item (Paper)
Additional Information: Event Dates: 3-7 March, 2003
Divisions: Faculty of Physical Sciences and Engineering > Electronics and Computer Science > Electronic & Software Systems
Item ID: 258419
Date Deposited: 28 Oct 2003
Last Modified: 02 Mar 2012 14:02
Contributors: Gonciari, Paul Theo (Author)
Al-Hashimi, Bashir (Author)
Nicolici, Nicola (Author)
Date: 2003
Additional Information: Event Dates: 3-7 March, 2003
Status: Published
Publisher: IEEE
Further Information:Google Scholar
ISI Citation Count:1
URI: http://eprints.soton.ac.uk/id/eprint/258419

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