Integration of a two-dimensional electrostatic actuator in a new generation of atom chips
Gollasch, C O, Moktadir, Zak, Koukharenko, Elena, Kraft, Michael, Bagnall, Darren, Eriksson, S, Trupke, M and Hinds, E A (2004) Integration of a two-dimensional electrostatic actuator in a new generation of atom chips. In, Eurosensors XVIII, Rome, Italy, 13 - 15 Sep 2004.
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Summary: In this paper we present an integrated atom chip design which incorporates a micromachined electrostatic actuator for optical cavity alignment. The two-dimensional actuator is fabricated by applying deep reactive ion etching techniques (DRIE) on a silicon-on-glass wafer. An actution of 17.5 um is achievable which is sufficient to compensate for the misalignment of the optical cavity during the fabrication process.
|Item Type:||Conference or Workshop Item (Paper)|
|Additional Information:||Event Dates: 13 - 15 September 2004|
|Keywords:||atom chip, actuator, electrostatic|
|Divisions :||Faculty of Physical Sciences and Engineering > Electronics and Computer Science > NANO
Faculty of Physical Sciences and Engineering > Electronics and Computer Science > EEE
|Accepted Date and Publication Date:||
|Date Deposited:||10 Feb 2005|
|Last Modified:||31 Mar 2016 14:01|
|Further Information:||Google Scholar|
|RDF:||RDF+N-Triples, RDF+N3, RDF+XML, Browse.|
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