Positive and Negative Photoresist as Thick Moulds for Electroplating High Aspect Ratio 3D Structures


Elejalde, N., Grigore, L., Ensell, G.J., Evans, A.G.R., Lee, S.L. and Ogrin, F.Y. (2001) Positive and Negative Photoresist as Thick Moulds for Electroplating High Aspect Ratio 3D Structures. At Micromechanics Europe 2001, NMRC, Cork, Ireland, 04 - 06 Oct 2001.

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Item Type: Conference or Workshop Item (Speech)
Additional Information: Event Dates: 4th-6th October 2001
Divisions: Faculty of Physical Sciences and Engineering > Electronics and Computer Science > NANO
ePrint ID: 260451
Date Deposited: 07 Feb 2005
Last Modified: 27 Mar 2014 20:03
Further Information:Google Scholar
URI: http://eprints.soton.ac.uk/id/eprint/260451

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