Positive and Negative Photoresist as Thick Moulds for Electroplating High Aspect Ratio 3D Structures
Elejalde, N., Grigore, L., Ensell, G.J., Evans, A.G.R., Lee, S.L. and Ogrin, F.Y. (2001) Positive and Negative Photoresist as Thick Moulds for Electroplating High Aspect Ratio 3D Structures. At Micromechanics Europe 2001, NMRC, Cork, Ireland, 04 - 06 Oct 2001.
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| Item Type: | Conference or Workshop Item (Speech) |
|---|---|
| Additional Information: | Event Dates: 4th-6th October 2001 |
| Divisions: | Faculty of Physical and Applied Science > Electronics and Computer Science > NANO |
| Item ID: | 260451 |
| Date Deposited: | 07 Feb 2005 |
| Last Modified: | 01 Mar 2012 11:06 |
| Contributors: | Elejalde, N. (Author) Grigore, L. (Author) Ensell, G.J. (Author) Evans, A.G.R. (Author) Lee, S.L. (Author) Ogrin, F.Y. (Author) |
| Date: | 2001 |
| Additional Information: | Event Dates: 4th-6th October 2001 |
| Status: | Published |
| Further Information: | Google Scholar |
| URI: | http://eprints.soton.ac.uk/id/eprint/260451 |
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