Fabrication of high temperature surface acoustic wave devices for sensor applications


Hamidon, MN, Skarda, V, White, NM, Krispel, F, Krempl, P, Binhack, M and Buff, W (2005) Fabrication of high temperature surface acoustic wave devices for sensor applications. Sensors and Actuators, A 123-, 403-407.

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Description/Abstract

Surface acoustic devices have been shown to be suitable not only for signal processing but also for sensor applications. In this paper high temperature surface acoustic wave devices based on gallium orthophosphate have been fabricated, using a lift-off technique and tested for high frequency applications at temperatures up to 600 ◦C. The measured S-parameter (S11) has been used to study the mass loading effect of the platinum electrodes and turnover temperature of GaPO4 with a 5◦ cut. The analysis of these results shows that the mass loading effect can be used to predict the desired resonant frequency of the SAW devices. Also two different adhesion layers for Pt metallisation were studied. Our results show that Zirconium is a more suitable under layer than Titanium.

Item Type: Article
Divisions: Faculty of Physical Sciences and Engineering > Electronics and Computer Science > EEE
ePrint ID: 262454
Date Deposited: 02 May 2006
Last Modified: 27 Mar 2014 20:05
Publisher: Elsevier
Further Information:Google Scholar
ISI Citation Count:10
URI: http://eprints.soton.ac.uk/id/eprint/262454

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