A technology for building shallow junction MOSFETs on vertical pillar walls


Tan, L., Buiu, O., Hall, S., Gili, E. and Ashburn, P. (2006) A technology for building shallow junction MOSFETs on vertical pillar walls. At 8th International Conference on Solid State Electronics & Integrated Technology, Shanghai, China, 23 - 26 Oct 2006.

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Description/Abstract

This work addresses a fundamental problem of vertical MOSFETS, that is, inherently deep junctions that exacerbate short channel effects (SCE). A self-aligned oxide region, or junction stop (JS) is formed at the top of the pillar and the shallow drain junction is then formed by out-diffusion from an overlying poly-crystalline drain contact region. The efficacy of the approach is demonstrated by simulation and the influence of the JS on SCE clearly shown. The process has been used to produce experimental devices that are characterized and discussed in the context of the modeling.

Item Type: Conference or Workshop Item (Speech)
Additional Information: Event Dates: October 23rd - 26th
Divisions: Faculty of Physical and Applied Science > Electronics and Computer Science > NANO
Item ID: 263286
Date Deposited: 03 Jan 2007
Last Modified: 02 Mar 2012 13:20
Contributors: Tan, L. (Author)
Buiu, O. (Author)
Hall, S. (Author)
Gili, E. (Author)
Ashburn, P. (Author)
Date: 2006
Additional Information: Event Dates: October 23rd - 26th
Status: Published
Further Information:Google Scholar
URI: http://eprints.soton.ac.uk/id/eprint/263286

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