Photoresist patterned thick-film piezoelectric elements on silicon
Frood, A, Beeby, S, Tudor, M and White, N (2007) Photoresist patterned thick-film piezoelectric elements on silicon. Journal Electroceramics
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Description/Abstract
A fundamental limitation of screen printing is the achievable alignment accuracy and resolution. This paper presents details of a thick-resist process that improves both of these factors. The technique involves exposing/developing a thick resist to form the desired pattern and then filling the features with thick film material using a doctor blading process. Registration accuracy comparable with standard photolithographic processes has been achieved resulting in minimum feature sizes of <50 μm and a film thickness of 100 μm. Piezoelectric elements have been successfully poled on a platinised silicon wafer with a measured d 33 value of 60 pCN−1.
| Item Type: | Article |
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| Related URLs: | |
| Divisions: | Faculty of Physical and Applied Science > Electronics and Computer Science > EEE |
| Item ID: | 263759 |
| Date Deposited: | 27 Mar 2007 |
| Last Modified: | 21 Aug 2012 03:49 |
| Contributors: | Frood, A (Author) Beeby, S (Author) Tudor, M (Author) White, N (Author) |
| Date: | March 2007 |
| Status: | Published |
| Further Information: | Google Scholar |
| ISI Citation Count: | 1 |
| URI: | http://eprints.soton.ac.uk/id/eprint/263759 |
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