Photoresist patterned thick-film piezoelectric elements on silicon
Frood, A, Beeby, S, Tudor, M and White, N (2007) Photoresist patterned thick-film piezoelectric elements on silicon. Journal Electroceramics
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A fundamental limitation of screen printing is the achievable alignment accuracy and resolution. This paper presents details of a thick-resist process that improves both of these factors. The technique involves exposing/developing a thick resist to form the desired pattern and then filling the features with thick film material using a doctor blading process. Registration accuracy comparable with standard photolithographic processes has been achieved resulting in minimum feature sizes of <50 μm and a film thickness of 100 μm. Piezoelectric elements have been successfully poled on a platinised silicon wafer with a measured d 33 value of 60 pCN−1.
|Divisions:||Faculty of Physical and Applied Science > Electronics and Computer Science > EEE
|Date Deposited:||27 Mar 2007|
|Last Modified:||21 Aug 2012 03:49|
|Contributors:||Frood, A (Author)
Beeby, S (Author)
Tudor, M (Author)
White, N (Author)
|Further Information:||Google Scholar|
|ISI Citation Count:||1|
|RDF:||RDF+N-Triples, RDF+N3, RDF+XML, Browse.|
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