On-chip electrical impedance tomography for 2D imaging of cells


Sun, Tao, Tsuda, Soichiro, Zauner, Klaus-Peter and Morgan, Hywel (2008) On-chip electrical impedance tomography for 2D imaging of cells. At 12th annual European conference on micro & nanoscale technologies for biosciences, Montreux, Switzerland, 16 - 19 Nov 2008.

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Description/Abstract

Electrical impedance spectroscopy (EIS) is a high speed, non-invasive and label-free technique to characterize the dielectric properties of biological cells. Impedance-based microfluidic cytometers allow fast and accurate analysis (identification and differentiation) of single cells. The electrical properties of the cell constructs can also be characterized using other impedance measurement techniques, such as electric cell-substrate impedance sensing (ECIS). However these measurements are generally performed only in 1 dimension (between the excitation electrode and the sensing electrode). Electrical impedance tomography (EIT) extends the measurements to 2 or 3 dimensions, where measurements are taken across multiple electrodes. The method can be used to generate “images” of conductivity/resistivity distribution inside a sample by performing the measurements on the periphery of the sample. In our work, a miniaturized EIT system is used to image a multi-nucleated cell-Physarum polycephalum in culture.

Item Type: Conference or Workshop Item (Poster)
Additional Information: Event Dates: 16th -19th, November, 2008
Divisions: Faculty of Physical and Applied Science > Electronics and Computer Science > NANO
Faculty of Physical and Applied Science > Electronics and Computer Science > Agents, Interactions & Complexity
Item ID: 266906
Date Deposited: 11 Nov 2008 12:12
Last Modified: 01 Mar 2012 11:46
Contributors: Sun, Tao (Author)
Tsuda, Soichiro (Author)
Zauner, Klaus-Peter (Author)
Morgan, Hywel (Author)
Date: November 2008
Additional Information: Event Dates: 16th -19th, November, 2008
Status: Published
Further Information:Google Scholar
URI: http://eprints.soton.ac.uk/id/eprint/266906

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