Assessment of the Impact of Joint Bays on the Ampacity of High Voltage Cable Circuits
Pilgrim, J A, Swaffield, D J, Lewin, P L, Larsen, S T and Payne, D (2009) Assessment of the Impact of Joint Bays on the Ampacity of High Voltage Cable Circuits. IEEE Transactions on Power Delivery, 24, (3), 1029-1036.
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Description/Abstract
Improvements in the cost and availability of computational power in recent years has led to numerical techniques such as finite element analysis (FEA) becoming viable for cable rating calculations. Such analysis has previously been completed for the case of directly buried and force cooled cable circuits, but without direct consideration of the joint bay. This paper presents methods by which conductor temperature profiles within joint bays may be obtained through the use of FEA. Results are presented for a number of joint bay configurations common to the UK for both naturally and force cooled installations. Implications of the results on circuit rating practice are discussed, along with the benefits of using tools such as FEA are considered against other existing methods.
| Item Type: | Article |
|---|---|
| ISSNs: | 0885-8977 |
| Divisions: | Faculty of Physical Sciences and Engineering > Electronics and Computer Science Faculty of Physical Sciences and Engineering > Electronics and Computer Science > EEE |
| Item ID: | 267016 |
| Date Deposited: | 06 Jan 2009 11:43 |
| Last Modified: | 23 Aug 2012 03:26 |
| Contributors: | Pilgrim, J A (Author) Swaffield, D J (Author) Lewin, P L (Author) Larsen, S T (Author) Payne, D (Author) |
| Date: | 1 July 2009 |
| Status: | Published |
| Publisher: | IEEE |
| Contact Email Address: | pll@ecs.soton.ac.uk |
| Further Information: | Google Scholar |
| ISI Citation Count: | 0 |
| URI: | http://eprints.soton.ac.uk/id/eprint/267016 |
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