Use of Finite Element Analysis to Obtain Thermal Ratings for High Voltage Cable Joint Bays
Pilgrim, J A, Swaffield, D J, Lewin, P L, Larsen, S T and Payne, D (2009) Use of Finite Element Analysis to Obtain Thermal Ratings for High Voltage Cable Joint Bays. In, 2009 IEEE Electrical Insulation Conference, Montreal, Canada, 31 May - 03 Jun 2009. IEEE, 224-227.
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Description/Abstract
Recent computational advances have increased the viability of using numerical modelling techniques such as finite element analysis (FEA) to compute the rating of cable circuits. Such analysis has previously been completed for directly buried and force cooled cable circuits, but without direct consideration of the joint bay. In previously presented work a 2D axially symmetric finite element model of a 400kV straight joint was created, allowing for a sensitivity analysis of the model parameters to be performed. Modelling has been subsequently expanded into 3D to allow the calculation of the temperature profile within a 3 phase circuit force cooled cable joint bay. This paper presents a discussion of results obtained from a model of the force cooled cable joint bay and the implications on the circuit rating.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Additional Information: | Event Dates: 31 May - 3 June 2009 |
| ISBNs: | 9781424439171 |
| Divisions: | Faculty of Physical and Applied Science > Electronics and Computer Science > EEE Faculty of Physical and Applied Science > Electronics and Computer Science |
| Item ID: | 267560 |
| Date Deposited: | 12 Jun 2009 16:12 |
| Last Modified: | 23 Aug 2012 03:44 |
| Contributors: | Pilgrim, J A (Author) Swaffield, D J (Author) Lewin, P L (Author) Larsen, S T (Author) Payne, D (Author) |
| Date: | 31 May 2009 |
| Additional Information: | Event Dates: 31 May - 3 June 2009 |
| Status: | Published |
| Publisher: | IEEE |
| Contact Email Address: | pll@ecs.soton.ac.uk |
| Further Information: | Google Scholar |
| ISI Citation Count: | 1 |
| URI: | http://eprints.soton.ac.uk/id/eprint/267560 |
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