Fabrication of MEMS components using ultrafine-grained aluminium alloys
Guang Qiao, Xiao , Gao, Nong, Moktadir, Zakaria, Kraft, Michael and Starink, Marco J. (2010) Fabrication of MEMS components using ultrafine-grained aluminium alloys. Journal of Micromechanics and Microengineering , 20, 045029.
- Published Version
A novel process for the fabrication of a microelectromechanical systems (MEMS) metallic component with features smaller than 10 µm and high thermal conductivity was investigated. This may be applied to new or improved microscale components, such as (micro-) heat exchangers. In the first stage of processing, equal channel angular pressing (ECAP) was employed to refine the grain size of commercial purity aluminium (Al-1050) to the ultrafine-grained (UFG) material. Embossing was conducted using a micro silicon mould fabricated by deep reactive ion etching (DRIE). Both cold embossing and hot embossing were performed on the coarse-grained and UFG Al-1050. Cold embossing on UFG Al-1050 led to a partially transferred pattern from the micro silicon mould and high failure rate of the mould. Hot embossing on UFG Al-1050 provided a smooth embossed surface with a fully transferred pattern and a low failure rate of the mould, while hot embossing on the coarse-grained Al-1050 resulted in a rougher surface with shear bands.
|Divisions:||Faculty of Physical and Applied Science > Electronics and Computer Science > NANO
|Date Deposited:||23 Mar 2010 09:38|
|Last Modified:||02 Mar 2012 13:01|
|Contributors:||Guang Qiao, Xiao (Author)
Gao, Nong (Author)
Moktadir, Zakaria (Author)
Kraft, Michael (Author)
Starink, Marco J. (Author)
|Further Information:||Google Scholar|
|RDF:||RDF+N-Triples, RDF+N3, RDF+XML, Browse.|
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