A self-aligned silicidation technology for surround gate vertical MOSFETs
Hakim, M.M.A., Mallik, K., de Groot, C.H., Redman-White, W., Ashburn, P., Tan, L. and Hall, S. (2009) A self-aligned silicidation technology for surround gate vertical MOSFETs. At European Solid State Device Research Conference (ESSDERC), Athens, GR, 14 - 18 Sep 2009. 4pp, 978-981.
- Published Version
We report for the first time a silicidation technology for surround gate vertical MOSFETs. The technology uses a double spacer comprising a polysilicon spacer for the surround gate and a nitride spacer for the silicidation. Silicided 120nm nchannel devices show a 30% improvement in drive current in comparison to non silicided devices, but this is accompanied by a small degradation in sub-threshold slope and DlBL. This problem is solved using a frame gate architecture in which the pillar sidewalls are protected from the silicidation process. Silicided frame gate transistors show a similar increase in drive current without any significant degradation of sub-threshold slope or DlBL. For a 120 nm channel length, silicided frame gate vertical nMOSFETs show a 30% improvement in the drive current with an excellent sub-threshold slope of 78mV/decade and a DIBL of 30 mVIV. For an 80 nm channel length, a 43% improvement in the drive current is obtained.
|Item Type:||Conference or Workshop Item (Poster)|
|Keywords:||vertical mosfets, silicidation|
|Subjects:||Q Science > QA Mathematics > QA75 Electronic computers. Computer science
T Technology > TK Electrical engineering. Electronics Nuclear engineering
T Technology > TP Chemical technology
|Divisions:||Faculty of Physical Sciences and Engineering > Electronics and Computer Science > NANO
|Date Deposited:||21 Apr 2010 02:22|
|Last Modified:||27 Mar 2014 20:15|
|Further Information:||Google Scholar|
|RDF:||RDF+N-Triples, RDF+N3, RDF+XML, Browse.|
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