Fabrication of MEMS components using ultra fine grained aluminium
Fabrication of MEMS components using ultra fine grained aluminium
A novel process for the fabrication of a microelectromechanical systems (MEMS) metallic component with features smaller than 10 µm and high thermal conductivity was investigated. This may be applied to new or improved microscale components, such as (micro-) heat exchangers. In the first stage of processing, equal channel angular pressing (ECAP) was employed to refine the grain size of commercial purity aluminium (Al-1050) to the ultrafine-grained (UFG) material. Embossing was conducted using a micro silicon mould fabricated by deep reactive ion etching (DRIE). Both cold embossing and hot embossing were performed on the coarse-grained and UFG Al-1050. Cold embossing on UFG Al-1050 led to a partially transferred pattern from the micro silicon mould and high failure rate of the mould. Hot embossing on UFG Al-1050 provided a smooth embossed surface with a fully transferred pattern and a low failure rate of the mould, while hot embossing on the coarse-grained Al-1050 resulted in a rougher surface with shear bands
45029
Qiao, X.
6df67c97-457c-47e5-a541-6a1316179522
Gao, N.
9c1370f7-f4a9-4109-8a3a-4089b3baec21
Moktadir, Zakaria
34472668-ffda-4287-8fea-2c4f3bf1e2fa
Michael, Kraft
54927621-738f-4d40-af56-a027f686b59f
Starink, M.J.
fe61a323-4e0c-49c7-91f0-4450e1ec1e51
2010
Qiao, X.
6df67c97-457c-47e5-a541-6a1316179522
Gao, N.
9c1370f7-f4a9-4109-8a3a-4089b3baec21
Moktadir, Zakaria
34472668-ffda-4287-8fea-2c4f3bf1e2fa
Michael, Kraft
54927621-738f-4d40-af56-a027f686b59f
Starink, M.J.
fe61a323-4e0c-49c7-91f0-4450e1ec1e51
Qiao, X., Gao, N., Moktadir, Zakaria, Michael, Kraft and Starink, M.J.
(2010)
Fabrication of MEMS components using ultra fine grained aluminium.
Journal of Micromechanics and Microengineering, 20 (4), .
(doi:10.1088/0960-1317/20/4/045029).
Abstract
A novel process for the fabrication of a microelectromechanical systems (MEMS) metallic component with features smaller than 10 µm and high thermal conductivity was investigated. This may be applied to new or improved microscale components, such as (micro-) heat exchangers. In the first stage of processing, equal channel angular pressing (ECAP) was employed to refine the grain size of commercial purity aluminium (Al-1050) to the ultrafine-grained (UFG) material. Embossing was conducted using a micro silicon mould fabricated by deep reactive ion etching (DRIE). Both cold embossing and hot embossing were performed on the coarse-grained and UFG Al-1050. Cold embossing on UFG Al-1050 led to a partially transferred pattern from the micro silicon mould and high failure rate of the mould. Hot embossing on UFG Al-1050 provided a smooth embossed surface with a fully transferred pattern and a low failure rate of the mould, while hot embossing on the coarse-grained Al-1050 resulted in a rougher surface with shear bands
Text
JMM_paper_to_Eprint.pdf
- Accepted Manuscript
More information
Published date: 2010
Organisations:
Nanoelectronics and Nanotechnology
Identifiers
Local EPrints ID: 270883
URI: http://eprints.soton.ac.uk/id/eprint/270883
ISSN: 0960-1317
PURE UUID: 9053e4f4-7f6d-482c-badc-0603188d0af4
Catalogue record
Date deposited: 21 Apr 2010 10:18
Last modified: 15 Mar 2024 03:10
Export record
Altmetrics
Contributors
Author:
X. Qiao
Author:
Zakaria Moktadir
Author:
Kraft Michael
Download statistics
Downloads from ePrints over the past year. Other digital versions may also be available to download e.g. from the publisher's website.
View more statistics
