The thermal and electrical properties of nano-silicon dioxide filled epoxy systems for use in high voltage insulation


Reading, M D, Xu, Z, Vaughan, A S and Lewin, P L (2011) The thermal and electrical properties of nano-silicon dioxide filled epoxy systems for use in high voltage insulation. In, IEEE 2011 Electrical Insulation Conference, Annapolis, Maryland, USA, 05 - 08 Jun 2011. IEEE, 492-496.

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Description/Abstract

Epoxy resins have proven to be an excellent insulation system in many application due to their excellent mechanical, thermal and electrical properties. This paper details an investigation into micro and nano silicon dioxide (SD and NSD respectively) filled epoxy systems and the resulting thermal and electrical properties of the composite. The effect of addition of the fillers relative to their particle size on the overall properties of a DER 332 epoxy was investigated. The composites were characterised using techniques such as differential scanning calorimetry (DSC)and AC breakdown to analyse the effect the filler has on the composite materials glass transition temperature and uniformity through breakdown variation.

Item Type: Conference or Workshop Item (Paper)
Additional Information: Event Dates: 5 - 8 June 2011
ISBNs: 9781457702761
Divisions: Faculty of Physical and Applied Science > Electronics and Computer Science
Faculty of Physical and Applied Science > Electronics and Computer Science > EEE
Item ID: 272423
Date Deposited: 07 Jun 2011 12:52
Last Modified: 19 Jul 2012 12:43
Contributors: Reading, M D (Author)
Xu, Z (Author)
Vaughan, A S (Author)
Lewin, P L (Author)
Date: 5 June 2011
Additional Information: Event Dates: 5 - 8 June 2011
Status: Published
Publisher: IEEE
Contact Email Address: pll@ecs.soton.ac.uk
Further Information:Google Scholar
ISI Citation Count:1
URI: http://eprints.soton.ac.uk/id/eprint/272423

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