Stoichiometry and Effects of Nano-sized and Micro-sized Fillers on an Epoxy Based System
Stoichiometry and Effects of Nano-sized and Micro-sized Fillers on an Epoxy Based System
Epoxy resin and its composites filled with microsized fillers have been commonly used in different electrical applications. A large amount of research has also considered the effects of the large interfacial areas associated with nanoscopic fillers on material properties, but little has concentrated on systems with stoichiometric proportions. This paper investigates effects of resin stoichiometry on dielectric properties, including the glass transition temperature, permittivity, and breakdown strength of an epoxy resin system and its composites filled with silica particles of different sizes.
302-305
Nguyen, V
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Vaughan, A S
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Lewin, P L
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Krivda, A
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16 October 2011
Nguyen, V
f0c0837a-052c-4a30-b64e-c607e49247a6
Vaughan, A S
6d813b66-17f9-4864-9763-25a6d659d8a3
Lewin, P L
78b4fc49-1cb3-4db9-ba90-3ae70c0f639e
Krivda, A
73f11276-1939-4036-893c-e32deb7eb80c
Nguyen, V, Vaughan, A S, Lewin, P L and Krivda, A
(2011)
Stoichiometry and Effects of Nano-sized and Micro-sized Fillers on an Epoxy Based System.
2011 Conference on Electrical Insulation and Dielectric Phenomena, Cancun, Mexico.
16 - 19 Oct 2011.
.
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Conference or Workshop Item
(Paper)
Abstract
Epoxy resin and its composites filled with microsized fillers have been commonly used in different electrical applications. A large amount of research has also considered the effects of the large interfacial areas associated with nanoscopic fillers on material properties, but little has concentrated on systems with stoichiometric proportions. This paper investigates effects of resin stoichiometry on dielectric properties, including the glass transition temperature, permittivity, and breakdown strength of an epoxy resin system and its composites filled with silica particles of different sizes.
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Published date: 16 October 2011
Additional Information:
Event Dates: 16-19 October 2011
Venue - Dates:
2011 Conference on Electrical Insulation and Dielectric Phenomena, Cancun, Mexico, 2011-10-16 - 2011-10-19
Organisations:
Electronics & Computer Science, EEE
Identifiers
Local EPrints ID: 272944
URI: http://eprints.soton.ac.uk/id/eprint/272944
PURE UUID: dadd2b45-45dc-4b84-af52-aaf3e72ce3ed
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Date deposited: 20 Oct 2011 14:08
Last modified: 15 Mar 2024 03:05
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Contributors
Author:
V Nguyen
Author:
A S Vaughan
Author:
P L Lewin
Author:
A Krivda
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