Stoichiometry and Effects of Nano-sized and Micro-sized Fillers on an Epoxy Based System
Nguyen, V, Vaughan, A S, Lewin, P L and Krivda, A (2011) Stoichiometry and Effects of Nano-sized and Micro-sized Fillers on an Epoxy Based System. In, 2011 Conference on Electrical Insulation and Dielectric Phenomena, Cancun, Mexico, 16 - 19 Oct 2011. IEEE, 302-305.
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Description/Abstract
Epoxy resin and its composites filled with microsized fillers have been commonly used in different electrical applications. A large amount of research has also considered the effects of the large interfacial areas associated with nanoscopic fillers on material properties, but little has concentrated on systems with stoichiometric proportions. This paper investigates effects of resin stoichiometry on dielectric properties, including the glass transition temperature, permittivity, and breakdown strength of an epoxy resin system and its composites filled with silica particles of different sizes.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Additional Information: | Event Dates: 16-19 October 2011 |
| ISSNs: | 0084-9162 |
| Divisions: | Faculty of Physical and Applied Science > Electronics and Computer Science Faculty of Physical and Applied Science > Electronics and Computer Science > EEE |
| Item ID: | 272944 |
| Date Deposited: | 20 Oct 2011 14:08 |
| Last Modified: | 30 Mar 2012 15:11 |
| Contributors: | Nguyen, V (Author) Vaughan, A S (Author) Lewin, P L (Author) Krivda, A (Author) |
| Date: | 16 October 2011 |
| Additional Information: | Event Dates: 16-19 October 2011 |
| Status: | Published |
| Publisher: | IEEE |
| Contact Email Address: | asv@ecs.soton.ac.uk |
| Further Information: | Google Scholar |
| URI: | http://eprints.soton.ac.uk/id/eprint/272944 |
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