Low, C.T.J. and Walsh, F.C.
Normal and anomalous electrodeposition of tin–copper alloys from methanesulphonic acid bath containing perfluorinated cationic surfactant.
Transactions of the Institute of Metal Finishing, 86, (6), . (doi:10.1179/174591908X304180).
Sn–Cu alloys were deposited from a 12?5 vol.-% (1?93 mol dm23) methanesulphonic acid bath containing a perfluorinated, cationic surfactant at 296 K. Electrodeposition was carried out under controlled flow conditions, using rotating disc, rotating cylinder and rotating cylinder Hull cell electrodes. The influences of deposition current and potential, rotation speed, cupric ion concentration, stannous ion level and surfactant concentration on the deposited alloy composition have been investigated. The presence of surfactant resulted in a shift in the Cu deposition potential compared to that of Sn deposition. Both ‘normal’ deposition (Cu deposited at a more positive potential than Sn) and ‘anomalous’ deposition (Sn deposited at a more positive potential than Cu) could be achieved. A series of Sn–Cu alloys was electrodeposited over a wide range of operating conditions to produce matte grey through golden yellow to light brown, surface finishes. Golden yellow coloured bronze deposits, containing 70–80 wt-% Cu and 20–30 wt-%Sn could be obtained. When Sn was deposited preferentially, the Cu content of the alloy was typically in the range 3–9 wt-% along the cathode of the rotating cylinder Hull cell.
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