Hegedűs, J., Gubicza, J., Kawasaki, M., Chinh, N.Q., Fogarassy, Zs. and Langdon, T.G.
The influence of impurity content on thermal stability of low stacking fault energy silver processed by severe plastic deformation.
Materials Science Forum, 729, . (doi:10.4028/www.scientific.net/MSF.729.222).
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The effect of the impurity content on the evolution of the ultrafine-grained (UFG) microstructure in low stacking fault energy Ag and its stability at room and elevated temperatures were investigated. Samples of silver having high (99.995%) and somewhat lower (99.99%) purity levels were processed by equal-channel angular pressing (ECAP) at room temperature (RT) up to 16 passes. Although, the minimum grain size achieved by ECAP was ~200 nm for both series, the lattice defect structure was strongly influenced by the impurity content. In the samples processed by 4-16 passes of ECAP a self-annealing occurred during storage RT that was promoted by the higher twin boundary frequency. Both room-and high-temperature thermal stability of 99.99% purity Ag were much better due to the pinning effect of impurities. It was found that a large number of dislocation loops remained in the microstructure even after recrystallization at high temperatures.
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