Thermal behaviour of epoxy resin filled with high thermal conductivity nanopowders
Thermal behaviour of epoxy resin filled with high thermal conductivity nanopowders
The improvement of heat conduction in electrical power equipment has become a very important issue. Thermoplastic and thermosetting polymers, which are mainly used for their insulating properties, have a relatively low thermal conductivity. One approach to change this is to introduce inorganic fillers which have high thermal conductivities compared to the polymer matrix. In this exploratory work we used commonly available bisphenol-A epoxy resin as a host material and high thermal conductivity nanopowders as fillers. Two types of nanopowders with different particles sizes and different ways of production have been used in this study. The content of nanopowder in the samples was varied from 0.5 to 10 % by weight. Morphological characterization of the prepared nanocomposites was carried out by transmission electron microscopy (TEM). The different models for predicting the thermal conductivity for two phase system are compared with experimental data of nanosized aluminum nitride and boron nitride particles filled epoxy composites. The Agari&Uno model correlated best with the experimental data.
978-1-4244-3917-1
524-528
Kochetov, R.
5647ae09-395a-4845-a4a9-51837a5c9aa0
Andritsch, T.
8681e640-e584-424e-a1f1-0d8b713de01c
Lafont, U.
384b46f6-42e7-42ed-a011-56081e5d6c85
Morshuis, P.H.F.
59248480-efdb-444e-b3f5-b39a3355315a
Picken, S.J.
d65451ac-e22e-4c42-88ec-bde69a6721b7
Smit, J.J.
21d902fe-6d70-4dff-ad29-3eb8146c0ea5
June 2009
Kochetov, R.
5647ae09-395a-4845-a4a9-51837a5c9aa0
Andritsch, T.
8681e640-e584-424e-a1f1-0d8b713de01c
Lafont, U.
384b46f6-42e7-42ed-a011-56081e5d6c85
Morshuis, P.H.F.
59248480-efdb-444e-b3f5-b39a3355315a
Picken, S.J.
d65451ac-e22e-4c42-88ec-bde69a6721b7
Smit, J.J.
21d902fe-6d70-4dff-ad29-3eb8146c0ea5
Kochetov, R., Andritsch, T., Lafont, U., Morshuis, P.H.F., Picken, S.J. and Smit, J.J.
(2009)
Thermal behaviour of epoxy resin filled with high thermal conductivity nanopowders.
EIC 2009. IEEE Electrical Insulation Conference, 2009.
31 May - 03 Jun 2009.
.
(doi:10.1109/EIC.2009.5166402).
Record type:
Conference or Workshop Item
(Paper)
Abstract
The improvement of heat conduction in electrical power equipment has become a very important issue. Thermoplastic and thermosetting polymers, which are mainly used for their insulating properties, have a relatively low thermal conductivity. One approach to change this is to introduce inorganic fillers which have high thermal conductivities compared to the polymer matrix. In this exploratory work we used commonly available bisphenol-A epoxy resin as a host material and high thermal conductivity nanopowders as fillers. Two types of nanopowders with different particles sizes and different ways of production have been used in this study. The content of nanopowder in the samples was varied from 0.5 to 10 % by weight. Morphological characterization of the prepared nanocomposites was carried out by transmission electron microscopy (TEM). The different models for predicting the thermal conductivity for two phase system are compared with experimental data of nanosized aluminum nitride and boron nitride particles filled epoxy composites. The Agari&Uno model correlated best with the experimental data.
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Published date: June 2009
Venue - Dates:
EIC 2009. IEEE Electrical Insulation Conference, 2009, 2009-05-31 - 2009-06-03
Organisations:
EEE
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Local EPrints ID: 354456
URI: http://eprints.soton.ac.uk/id/eprint/354456
ISBN: 978-1-4244-3917-1
PURE UUID: a82c2157-59a5-485b-9a70-54a73af0f5c6
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Date deposited: 30 Jul 2013 10:31
Last modified: 15 Mar 2024 03:48
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Author:
R. Kochetov
Author:
T. Andritsch
Author:
U. Lafont
Author:
P.H.F. Morshuis
Author:
S.J. Picken
Author:
J.J. Smit
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