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Effect of filler size on complex permittivity and thermal conductivity of epoxy-based composites filled with BN particles

Effect of filler size on complex permittivity and thermal conductivity of epoxy-based composites filled with BN particles
Effect of filler size on complex permittivity and thermal conductivity of epoxy-based composites filled with BN particles
Epoxy resin is one of the most widely used thermosetting polymers and commonly applied in electrical power engineering. The intrinsic properties of epoxy can be improved by the introduction of inorganic filler, thus fabricating a composite material. In this study we investigate the influence of the filler size and its concentration on the complex permittivity and thermal conductivity of epoxy. The filler material that has been used is boron nitride. Boron nitride is a ceramic dielectric material with high electric breakdown strength and high thermal conductivity, while exhibiting a low relative permittivity. Four types of composites were prepared with an average particle size of 70 nm, 0.5 ?m, 1.5 ?m and 5 ?m and a filler concentration of 10 and 20 percent by weight. The surface of the particles was functionalized with a coupling agent in order to see the effect of the modification on the specific properties. Two different techniques were applied to get the particles well dispersed in the matrix: high shear mechanical mixing and ultrasonication. The results of dielectric spectroscopy show, that the relative permittivity of the composite material increases more when introducing particles which have a larger average size. The highest value of thermal conductivity was obtained for the composite containing 20 wt.% inorganic particles with average particle size of 0.5 ?m. Explanations are given for the observed behaviour.
978-1-4244-9468-2
1-4
Kochetov, R.
5647ae09-395a-4845-a4a9-51837a5c9aa0
Andritsch, T.
8681e640-e584-424e-a1f1-0d8b713de01c
Morshuis, P.H.F.
59248480-efdb-444e-b3f5-b39a3355315a
Smit, J.J.
21d902fe-6d70-4dff-ad29-3eb8146c0ea5
Kochetov, R.
5647ae09-395a-4845-a4a9-51837a5c9aa0
Andritsch, T.
8681e640-e584-424e-a1f1-0d8b713de01c
Morshuis, P.H.F.
59248480-efdb-444e-b3f5-b39a3355315a
Smit, J.J.
21d902fe-6d70-4dff-ad29-3eb8146c0ea5

Kochetov, R., Andritsch, T., Morshuis, P.H.F. and Smit, J.J. (2010) Effect of filler size on complex permittivity and thermal conductivity of epoxy-based composites filled with BN particles. 2010 Annual Report Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), West Lafayette, United States. 17 - 20 Oct 2010. pp. 1-4 . (doi:10.1109/CEIDP.2010.5723962).

Record type: Conference or Workshop Item (Paper)

Abstract

Epoxy resin is one of the most widely used thermosetting polymers and commonly applied in electrical power engineering. The intrinsic properties of epoxy can be improved by the introduction of inorganic filler, thus fabricating a composite material. In this study we investigate the influence of the filler size and its concentration on the complex permittivity and thermal conductivity of epoxy. The filler material that has been used is boron nitride. Boron nitride is a ceramic dielectric material with high electric breakdown strength and high thermal conductivity, while exhibiting a low relative permittivity. Four types of composites were prepared with an average particle size of 70 nm, 0.5 ?m, 1.5 ?m and 5 ?m and a filler concentration of 10 and 20 percent by weight. The surface of the particles was functionalized with a coupling agent in order to see the effect of the modification on the specific properties. Two different techniques were applied to get the particles well dispersed in the matrix: high shear mechanical mixing and ultrasonication. The results of dielectric spectroscopy show, that the relative permittivity of the composite material increases more when introducing particles which have a larger average size. The highest value of thermal conductivity was obtained for the composite containing 20 wt.% inorganic particles with average particle size of 0.5 ?m. Explanations are given for the observed behaviour.

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Published date: October 2010
Venue - Dates: 2010 Annual Report Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), West Lafayette, United States, 2010-10-17 - 2010-10-20
Organisations: EEE

Identifiers

Local EPrints ID: 354457
URI: http://eprints.soton.ac.uk/id/eprint/354457
ISBN: 978-1-4244-9468-2
PURE UUID: 578607b4-b12b-4441-ab06-3705dcca970f
ORCID for T. Andritsch: ORCID iD orcid.org/0000-0002-3462-022X

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Date deposited: 30 Jul 2013 10:49
Last modified: 15 Mar 2024 03:48

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Contributors

Author: R. Kochetov
Author: T. Andritsch ORCID iD
Author: P.H.F. Morshuis
Author: J.J. Smit

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