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Thermal and electrical behaviour of epoxy-based microcomposites filled with Al2O3 and SiO2 particles

Thermal and electrical behaviour of epoxy-based microcomposites filled with Al2O3 and SiO2 particles
Thermal and electrical behaviour of epoxy-based microcomposites filled with Al2O3 and SiO2 particles
Epoxy resin is a polar thermosetting polymer that is widely employed in different branches of industry and everyday life, due to their stable physical and chemical properties. Of all the polymer materials currently being used in the electrical insulation industry, epoxy resin is the most widely used kind, together with polyethylene and chosen as the base polymer material in the present study. As a common practice, in order to obtain materials of the desired thermal, mechanical and electrical properties, polymers are processed with different types of inorganic fillers. In this paper, the authors made an attempt to thoroughly analyze both the thermal and the electrical behaviour of the created epoxy microcomposites. Epoxy-based composites containing microparticles of aluminum oxide and silicon dioxide were prepared by high shear mechanical mixing and ultrasonic processing to obtain a fine dispersion of the fillers in the matrix. The incorporation of all filler types led to noticeable improvement in thermal conductivity compared to the pure epoxy resin. The thermal conductivity and the relative permittivity of the composites were greatly influenced by the filler loading of the inorganic particles. Rules of mixture are used to predict the thermal conductivity and the relative permittivity of two-phase composites have been applied to compare experimental results with theoretical models.
978-1-4244-6298-8
1-5
Kochetov, Roman
9132fe00-0536-4082-a4ce-54253b2e9fe0
Andritsch, Thomas
8681e640-e584-424e-a1f1-0d8b713de01c
Morshuis, Peter H.F.
52ee8690-43df-4325-b9df-3b02a8deed87
Smit, Johan J.
2a25b796-b15f-485c-b10d-08a813481c42
Kochetov, Roman
9132fe00-0536-4082-a4ce-54253b2e9fe0
Andritsch, Thomas
8681e640-e584-424e-a1f1-0d8b713de01c
Morshuis, Peter H.F.
52ee8690-43df-4325-b9df-3b02a8deed87
Smit, Johan J.
2a25b796-b15f-485c-b10d-08a813481c42

Kochetov, Roman, Andritsch, Thomas, Morshuis, Peter H.F. and Smit, Johan J. (2010) Thermal and electrical behaviour of epoxy-based microcomposites filled with Al2O3 and SiO2 particles. 2010 International Symposium on Electrical Insulation, San Diego Country Estates, United States. 06 - 09 Jun 2010. pp. 1-5 . (doi:10.1109/ELINSL.2010.5549745).

Record type: Conference or Workshop Item (Paper)

Abstract

Epoxy resin is a polar thermosetting polymer that is widely employed in different branches of industry and everyday life, due to their stable physical and chemical properties. Of all the polymer materials currently being used in the electrical insulation industry, epoxy resin is the most widely used kind, together with polyethylene and chosen as the base polymer material in the present study. As a common practice, in order to obtain materials of the desired thermal, mechanical and electrical properties, polymers are processed with different types of inorganic fillers. In this paper, the authors made an attempt to thoroughly analyze both the thermal and the electrical behaviour of the created epoxy microcomposites. Epoxy-based composites containing microparticles of aluminum oxide and silicon dioxide were prepared by high shear mechanical mixing and ultrasonic processing to obtain a fine dispersion of the fillers in the matrix. The incorporation of all filler types led to noticeable improvement in thermal conductivity compared to the pure epoxy resin. The thermal conductivity and the relative permittivity of the composites were greatly influenced by the filler loading of the inorganic particles. Rules of mixture are used to predict the thermal conductivity and the relative permittivity of two-phase composites have been applied to compare experimental results with theoretical models.

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Published date: 2010
Venue - Dates: 2010 International Symposium on Electrical Insulation, San Diego Country Estates, United States, 2010-06-06 - 2010-06-09
Organisations: EEE

Identifiers

Local EPrints ID: 354462
URI: http://eprints.soton.ac.uk/id/eprint/354462
ISBN: 978-1-4244-6298-8
PURE UUID: 88c9cd92-3dfd-424d-a1b8-f81faaa34c89
ORCID for Thomas Andritsch: ORCID iD orcid.org/0000-0002-3462-022X

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Date deposited: 30 Jul 2013 10:52
Last modified: 15 Mar 2024 03:48

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Contributors

Author: Roman Kochetov
Author: Thomas Andritsch ORCID iD
Author: Peter H.F. Morshuis
Author: Johan J. Smit

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