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Surface Resistance of Epoxy/BN Micro- and Mesocomposites Exposed to Electrical Discharges

Surface Resistance of Epoxy/BN Micro- and Mesocomposites Exposed to Electrical Discharges
Surface Resistance of Epoxy/BN Micro- and Mesocomposites Exposed to Electrical Discharges
Boron nitride (BN) has shown in the past to improve DC breakdown strength as well as augmenting thermal conductivity. Two different filler sizes, one micrometric with an average particle size of 9 µm and a submicrometric one, 0.5 ?m in size, have been used to form composites. The amount of each type of BN in the matrix has been varied from 1 to 5 wt%. The samples have been exposed to electrical discharges using a point-to-plane geometry operated in open air. The experiment was conducted at an enhanced frequency of 300 Hz to accelerate the erosion process. The surface erosion has been evaluated after several distinct time steps using a mechanical profilometer. It has been found that introducing BN into epoxy decreases the amount of eroded volume of the organic matrix with decreasing filler amount. In addition, micrometric BN composites performed better than their sub-micrometric counterparts. The dielectric response has been evaluated using broadband dielectric spectroscopy (BDS) at 20°C before the erosion, as well as after each time step. An increase of dielectric losses at very low frequencies for all samples after erosion has been observed, accompanied by a slight increase in real permittivity. Besides the β peak, the formation of an additional loss peak, located around 1 Hz, has been found.
978-1-4673-4459-3
872-875
Heid, T
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Savoie, S
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Vanga, C
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Frechette, M
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David, E
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Freebody, N A
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Vaughan, A S
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Heid, T
6be6597f-4836-4535-ab30-fd7d3ca48a77
Savoie, S
1fe17702-f2c3-42c0-bb7c-acdec9053b68
Vanga, C
402679be-0f99-4819-991f-a650897f471b
Frechette, M
87de4199-63e1-46ff-b8c0-6778f808759e
David, E
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Freebody, N A
fdec3bc9-0399-43bb-83a3-b099dd431c3f
Vaughan, A S
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Heid, T, Savoie, S, Vanga, C, Frechette, M, David, E, Freebody, N A and Vaughan, A S (2013) Surface Resistance of Epoxy/BN Micro- and Mesocomposites Exposed to Electrical Discharges. IEEE 2013 International Conference on Solid Dielectrics (ICSD), , Bologna, Italy. 30 Jun - 04 Jul 2013. pp. 872-875 .

Record type: Conference or Workshop Item (Paper)

Abstract

Boron nitride (BN) has shown in the past to improve DC breakdown strength as well as augmenting thermal conductivity. Two different filler sizes, one micrometric with an average particle size of 9 µm and a submicrometric one, 0.5 ?m in size, have been used to form composites. The amount of each type of BN in the matrix has been varied from 1 to 5 wt%. The samples have been exposed to electrical discharges using a point-to-plane geometry operated in open air. The experiment was conducted at an enhanced frequency of 300 Hz to accelerate the erosion process. The surface erosion has been evaluated after several distinct time steps using a mechanical profilometer. It has been found that introducing BN into epoxy decreases the amount of eroded volume of the organic matrix with decreasing filler amount. In addition, micrometric BN composites performed better than their sub-micrometric counterparts. The dielectric response has been evaluated using broadband dielectric spectroscopy (BDS) at 20°C before the erosion, as well as after each time step. An increase of dielectric losses at very low frequencies for all samples after erosion has been observed, accompanied by a slight increase in real permittivity. Besides the β peak, the formation of an additional loss peak, located around 1 Hz, has been found.

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Published date: 4 June 2013
Venue - Dates: IEEE 2013 International Conference on Solid Dielectrics (ICSD), , Bologna, Italy, 2013-06-30 - 2013-07-04
Organisations: EEE

Identifiers

Local EPrints ID: 354647
URI: http://eprints.soton.ac.uk/id/eprint/354647
ISBN: 978-1-4673-4459-3
PURE UUID: 9c63125b-0add-4331-bed8-8797b804c2fb
ORCID for A S Vaughan: ORCID iD orcid.org/0000-0002-0535-513X

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Date deposited: 16 Jul 2013 11:56
Last modified: 15 Mar 2024 03:06

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Contributors

Author: T Heid
Author: S Savoie
Author: C Vanga
Author: M Frechette
Author: E David
Author: N A Freebody
Author: A S Vaughan ORCID iD

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