Wear resistance and electroconductivity in copper processed by severe plastic deformation
Wear resistance and electroconductivity in copper processed by severe plastic deformation
The wear properties and electroconductivity of three ultra-fine grained (UFG) commercially pure copper materials, subjected to combinations of high-pressure torsion (HPT) and equal-channel angular pressing (ECAP), were studied and compared with conventional coarse-grained (CG) copper. The results are discussed as a function of microstructure and microtexture. The UFG specimens demonstrate no significant decrease in electroconductivity by comparison with CG copper. The conductivity of an ECAP+HPT specimen showed a value of 99.3% of annealed copper and the same sample showed the lowest wear rate among the UFG specimens. However, all UFG specimens gave higher wear rates than CG copper and there was no evidence for the enhanced wear resistance reported for nanocrystalline copper obtained by surface mechanical attrition treatment (SMAT) and electrodeposition. This result is discussed in the context of two competing processes: shear by sliding and normal compression by impact load.
severe plastic deformation, copper, microstructure, electroconductivity, wear
89-99
Zhilyaev, Alexander P.
d053e518-1976-4633-8953-e8f34b9b7c44
Shakhova, I.
d9e7359a-9f8d-4007-b433-ed5069c686fe
Belyakov, A.
158def6c-a5ab-490a-a1b6-1b15fe9afbfe
Kaibyshev, R.
50740e0c-6465-4033-8379-38dcee0d6b4e
Langdon, Terence G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86
30 July 2013
Zhilyaev, Alexander P.
d053e518-1976-4633-8953-e8f34b9b7c44
Shakhova, I.
d9e7359a-9f8d-4007-b433-ed5069c686fe
Belyakov, A.
158def6c-a5ab-490a-a1b6-1b15fe9afbfe
Kaibyshev, R.
50740e0c-6465-4033-8379-38dcee0d6b4e
Langdon, Terence G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86
Zhilyaev, Alexander P., Shakhova, I., Belyakov, A., Kaibyshev, R. and Langdon, Terence G.
(2013)
Wear resistance and electroconductivity in copper processed by severe plastic deformation.
Wear, 305 (1-2), .
(doi:10.1016/j.wear.2013.06.001).
Abstract
The wear properties and electroconductivity of three ultra-fine grained (UFG) commercially pure copper materials, subjected to combinations of high-pressure torsion (HPT) and equal-channel angular pressing (ECAP), were studied and compared with conventional coarse-grained (CG) copper. The results are discussed as a function of microstructure and microtexture. The UFG specimens demonstrate no significant decrease in electroconductivity by comparison with CG copper. The conductivity of an ECAP+HPT specimen showed a value of 99.3% of annealed copper and the same sample showed the lowest wear rate among the UFG specimens. However, all UFG specimens gave higher wear rates than CG copper and there was no evidence for the enhanced wear resistance reported for nanocrystalline copper obtained by surface mechanical attrition treatment (SMAT) and electrodeposition. This result is discussed in the context of two competing processes: shear by sliding and normal compression by impact load.
This record has no associated files available for download.
More information
e-pub ahead of print date: 7 June 2013
Published date: 30 July 2013
Keywords:
severe plastic deformation, copper, microstructure, electroconductivity, wear
Organisations:
Engineering Mats & Surface Engineerg Gp
Identifiers
Local EPrints ID: 359502
URI: http://eprints.soton.ac.uk/id/eprint/359502
ISSN: 0043-1648
PURE UUID: 2065453a-5171-4c71-88bb-c54fe6778082
Catalogue record
Date deposited: 05 Nov 2013 11:35
Last modified: 15 Mar 2024 03:13
Export record
Altmetrics
Contributors
Author:
Alexander P. Zhilyaev
Author:
I. Shakhova
Author:
A. Belyakov
Author:
R. Kaibyshev
Download statistics
Downloads from ePrints over the past year. Other digital versions may also be available to download e.g. from the publisher's website.
View more statistics
