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Clock calibration faults and their impact on quality of high performance microprocessors

Clock calibration faults and their impact on quality of high performance microprocessors
Clock calibration faults and their impact on quality of high performance microprocessors
In this paper we analyze the fault effects of some clock calibration features which are common to today's high performance microprocessors. We show that induced faults with such schemes may give rise to effects that are not detectable by common manufacturing testing (e.g. scan based). However, these faults could seriously impact the microprocessor correct operation, and result in a decrease of product quality. Similar considerations may apply to different microprocessor calibration features. Considering that there is a wide range of process variations on die, as well as across the process, and that very deep sub-micron circuits tend to provide higher levels of performance to the circuits, the use of such on-die calibration features will increase in all segments of design. Proper strategies to test these features cannot be ignored
0-7695-2042-1
63-70
Metra, Cecilia
c420be13-a9cf-471a-96fb-3f43a694ffae
Mak, T.M.
30c42382-cf0a-447d-8695-fa229b7b8a2f
Metra, Cecilia
c420be13-a9cf-471a-96fb-3f43a694ffae
Mak, T.M.
30c42382-cf0a-447d-8695-fa229b7b8a2f

Metra, Cecilia and Mak, T.M. (2003) Clock calibration faults and their impact on quality of high performance microprocessors. 18th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems, Boston, United States. 03 - 05 Nov 2003. pp. 63-70 . (doi:10.1109/DFTVS.2003.1250096).

Record type: Conference or Workshop Item (Paper)

Abstract

In this paper we analyze the fault effects of some clock calibration features which are common to today's high performance microprocessors. We show that induced faults with such schemes may give rise to effects that are not detectable by common manufacturing testing (e.g. scan based). However, these faults could seriously impact the microprocessor correct operation, and result in a decrease of product quality. Similar considerations may apply to different microprocessor calibration features. Considering that there is a wide range of process variations on die, as well as across the process, and that very deep sub-micron circuits tend to provide higher levels of performance to the circuits, the use of such on-die calibration features will increase in all segments of design. Proper strategies to test these features cannot be ignored

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Published date: November 2003
Venue - Dates: 18th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems, Boston, United States, 2003-11-03 - 2003-11-05
Organisations: Electronic & Software Systems

Identifiers

Local EPrints ID: 368880
URI: http://eprints.soton.ac.uk/id/eprint/368880
ISBN: 0-7695-2042-1
PURE UUID: c62e1305-fe06-4bb2-9257-3052275c5eaa

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Date deposited: 06 Oct 2014 12:52
Last modified: 14 Mar 2024 17:55

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Contributors

Author: Cecilia Metra
Author: T.M. Mak

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