Physical and chemical changes under thermal cycling of an extrinsic conducting polymer electrical contact
Lam, Liza, McBride, John and Swingler, Jonathan (2006) Physical and chemical changes under thermal cycling of an extrinsic conducting polymer electrical contact. In, 23rd International Conference on Electrical Contacts, together with International Session on Electro-Mechanical Devices 2006, Sendai, Japan, 06 - 09 Jun 2006. Tokyo, Japan, Institute of Electronics, Information and Communication Engineers, 485-490.
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Description/Abstract
The increasing level of integrated wiring and electrical systems
has led to much diversity in connector trends within the
automotive industry. The use of Extrinsic Conducting Polymer
(ECP) material has been exploited in the production of densely
packed sockets and connectors. The ECP consists of metallized
particles embedded within a polymer compound, which are
formed into a cylindrical column. A matrix of ECP columns are
assembled onto a polyimide substrate that is commonly
sandwiched between the terminal pads of printed circuit boards
(PCB) to form an ECP-contact system. The reliability and
stability of different ECP-contact systems are evaluated under
environmental conditions depicting practical situations where
high temperatures and large thermal variations may be
experienced in the engine compartment of a vehicle. In this paper,
the investigation focuses on the influence of thermal shock cycles
while measuring the resistance of the ECP-contact systems. It has
been found that the change in resistance is mainly attributed to
physical and chemical variations at the contact interface. In order
to analyse physical deformations of the contact interfaces,
surface profiles of the ECP columns and PCB terminal pads have
been measured before and after the thermal shock test.
Meanwhile, the non destructive analysis technique of Raman
spectroscopy has been introduced to study the chemical changes.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Related URLs: | |
| Keywords: | reliability, conducting polymer, contact system, thermal shock |
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering Q Science > QD Chemistry T Technology > TL Motor vehicles. Aeronautics. Astronautics |
| Divisions: | University Structure - Pre August 2011 > School of Engineering Sciences > Electro-Mechanical Engineering |
| Item ID: | 39281 |
| Date Deposited: | 27 Jun 2006 |
| Last Modified: | 02 Mar 2012 11:27 |
| Contributors: | Lam, Liza (Author) McBride, John (Author) Swingler, Jonathan (Author) |
| Date: | June 2006 |
| Status: | Published |
| Publisher: | Institute of Electronics, Information and Communication Engineers |
| URI: | http://eprints.soton.ac.uk/id/eprint/39281 |
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