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A survey of emerging interconnects for on-chip efficient multicast and broadcast in many-cores

A survey of emerging interconnects for on-chip efficient multicast and broadcast in many-cores
A survey of emerging interconnects for on-chip efficient multicast and broadcast in many-cores
Networks-on-chip (NoC) have emerged to tackle different on-chip communication challenges and can satisfy different demands in terms of performance, cost and reliability. Currently, interconnects based on metal are reaching performance limits given relentless technology scaling. In particular, a performance bottleneck has emerged due to the demands for communication in terms of bandwidth for multicasting and broadcasting. As a result, various state-of-the-art architectures have been proposed as alternatives and emerging interconnects including the use of optics or radio frequency (RF). This article presents a comprehensive survey of these various interconnect fabrics, and discusses their current and future potentials and obstacles as well. This article aims to drive the research community to achieve a better utilization of the merits of on-chip interconnects and addresses the challenges involved. New interconnect technologies, such as optical interconnect, wireless NoC (WiNoC), RF transmission lines (RF-I) and surface wave interconnects (SWI), are discussed, evaluated and compared. Consequently, these emerging interconnects can continue to provide the cost efficiency and performance that are highly demanded for future many-core processors and high performance computing.
1531-636X
58-72
Karkar, Ammar
a27b7273-a3a4-47a4-ac73-20e464b2430f
Mak, Terrence
0f90ac88-f035-4f92-a62a-7eb92406ea53
Tong, Kin-Fai
dfcbfe21-30b2-461c-9078-d7ed1389dcd4
Yakolev, Alex
adc3f2e1-0741-499d-a218-8a1be06176a9
Karkar, Ammar
a27b7273-a3a4-47a4-ac73-20e464b2430f
Mak, Terrence
0f90ac88-f035-4f92-a62a-7eb92406ea53
Tong, Kin-Fai
dfcbfe21-30b2-461c-9078-d7ed1389dcd4
Yakolev, Alex
adc3f2e1-0741-499d-a218-8a1be06176a9

Karkar, Ammar, Mak, Terrence, Tong, Kin-Fai and Yakolev, Alex (2016) A survey of emerging interconnects for on-chip efficient multicast and broadcast in many-cores. IEEE Circuits and Systems Magazine, 16 (1), 58-72. (doi:10.1109/MCAS.2015.2510199).

Record type: Article

Abstract

Networks-on-chip (NoC) have emerged to tackle different on-chip communication challenges and can satisfy different demands in terms of performance, cost and reliability. Currently, interconnects based on metal are reaching performance limits given relentless technology scaling. In particular, a performance bottleneck has emerged due to the demands for communication in terms of bandwidth for multicasting and broadcasting. As a result, various state-of-the-art architectures have been proposed as alternatives and emerging interconnects including the use of optics or radio frequency (RF). This article presents a comprehensive survey of these various interconnect fabrics, and discusses their current and future potentials and obstacles as well. This article aims to drive the research community to achieve a better utilization of the merits of on-chip interconnects and addresses the challenges involved. New interconnect technologies, such as optical interconnect, wireless NoC (WiNoC), RF transmission lines (RF-I) and surface wave interconnects (SWI), are discussed, evaluated and compared. Consequently, these emerging interconnects can continue to provide the cost efficiency and performance that are highly demanded for future many-core processors and high performance computing.

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More information

Published date: 11 February 2016
Organisations: Electronic & Software Systems

Identifiers

Local EPrints ID: 401848
URI: http://eprints.soton.ac.uk/id/eprint/401848
ISSN: 1531-636X
PURE UUID: 79c17ff1-cacb-4efa-b344-5e3d2c8697a2

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Date deposited: 21 Oct 2016 15:28
Last modified: 15 Mar 2024 02:56

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Contributors

Author: Ammar Karkar
Author: Terrence Mak
Author: Kin-Fai Tong
Author: Alex Yakolev

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