On the concept of a fully bonded coupon gauge for stress separation from thermoelastic data


Stanley, P., Dulieu-Barton, J.M. and Emery, T.R. (2008) On the concept of a fully bonded coupon gauge for stress separation from thermoelastic data. Journal of Strain Analysis for Engineering Design, 43, (6), 507-517. (doi:10.1243/03093247JSA363).

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Original Publication URL: http://dx.doi.org/10.1243/03093247JSA363

Description/Abstract

Several forms of gauge can be used for the determination of individual stresses from thermoelastic data alone. A particularly useful form of gauge is the ‘coupon gauge’, consisting of a thin coupon of material which is bonded to the stressed specimen (or substrate). A novel formulation of the thermoelastic response of the fully bonded thermoelastic coupon gauge is used as the basis for the appraisal of the four possible gauge–specimen material combinations. The validity of the principal assumptions underlying the performance of these gauges is demonstrated and it is shown experimentally that the behaviour of samples of the orthotropic gauge–isotropic specimen material combination conforms to theory.

Item Type: Article
ISSNs: 0309-3247 (print)
Related URLs:
Keywords: thermoelastic stress analysis, stress separation, bonded gauge
Subjects: T Technology > TJ Mechanical engineering and machinery
Divisions: University Structure - Pre August 2011 > School of Engineering Sciences > Fluid-Structure Interactions
ePrint ID: 55656
Date Deposited: 04 Aug 2008
Last Modified: 27 Mar 2014 18:38
URI: http://eprints.soton.ac.uk/id/eprint/55656

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