On the concept of a fully bonded coupon gauge for stress separation from thermoelastic data
Stanley, P., Dulieu-Barton, J.M. and Emery, T.R. (2008) On the concept of a fully bonded coupon gauge for stress separation from thermoelastic data. Journal of Strain Analysis for Engineering Design, 43, (6), 507-517. (doi:10.1243/03093247JSA363).
Full text not available from this repository.
Several forms of gauge can be used for the determination of individual stresses from thermoelastic data alone. A particularly useful form of gauge is the ‘coupon gauge’, consisting of a thin coupon of material which is bonded to the stressed specimen (or substrate). A novel formulation of the thermoelastic response of the fully bonded thermoelastic coupon gauge is used as the basis for the appraisal of the four possible gauge–specimen material combinations. The validity of the principal assumptions underlying the performance of these gauges is demonstrated and it is shown experimentally that the behaviour of samples of the orthotropic gauge–isotropic specimen material combination conforms to theory.
|Keywords:||thermoelastic stress analysis, stress separation, bonded gauge|
|Subjects:||T Technology > TJ Mechanical engineering and machinery|
|Divisions:||University Structure - Pre August 2011 > School of Engineering Sciences > Fluid-Structure Interactions
|Date Deposited:||04 Aug 2008|
|Last Modified:||01 Jun 2011 00:31|
|Contact Email Address:||firstname.lastname@example.org|
|RDF:||RDF+N-Triples, RDF+N3, RDF+XML, Browse.|
Actions (login required)