The influence of bromine adsorption on copper electrodeposition on polycrystalline gold electrodes modified with self-assembled monolayers


Zhang, X.G., Li, X.H. and Li, H.L. (2001) The influence of bromine adsorption on copper electrodeposition on polycrystalline gold electrodes modified with self-assembled monolayers. Journal of Colloid and Interface Science, 234, (1), 68-71. (doi:10.1006/jcis.2000.7307).

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Original Publication URL: http://dx.doi.org/10.1006/jcis.2000.7307

Description/Abstract

The influence of bromine adsorption on copper electrodeposition on a polycrystalline gold electrode modified with self-assembled monolayers (SAMs) has been investigated by chronoamperometry and cyclic voltammetry. It was found that the deposition potential of copper was shifted negatively due to the SAMs. The hydrogen bond interaction between ω-carboxyl thiols decreased the defect density of the SAMs and significantly retarded the deposition of copper. The presence of bromide anions also shifted the potential more negatively through adsorption into the defects of SAMs.

Item Type: Article
ISSNs: 0021-9797 (print)
Related URLs:
Keywords: electrodeposition, self-assembled monolayer, specific adsorptive anion
Subjects: Q Science > QD Chemistry
Divisions: University Structure - Pre August 2011 > School of Engineering Sciences > Engineering Materials & Surface Engineering
Item ID: 63270
Date Deposited: 25 Sep 2008
Last Modified: 01 Jun 2011 07:19
Contributors: Zhang, X.G. (Author)
Li, X.H. (Author)
Li, H.L. (Author)
Date: 1 February 2001
Status: Published
Contact Email Address: lihl@lzu.edu.cn
URI: http://eprints.soton.ac.uk/id/eprint/63270

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