The influence of bromine adsorption on copper electrodeposition on polycrystalline gold electrodes modified with self-assembled monolayers
Zhang, X.G., Li, X.H. and Li, H.L. (2001) The influence of bromine adsorption on copper electrodeposition on polycrystalline gold electrodes modified with self-assembled monolayers. Journal of Colloid and Interface Science, 234, (1), 68-71. (doi:10.1006/jcis.2000.7307).
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The influence of bromine adsorption on copper electrodeposition on a polycrystalline gold electrode modified with self-assembled monolayers (SAMs) has been investigated by chronoamperometry and cyclic voltammetry. It was found that the deposition potential of copper was shifted negatively due to the SAMs. The hydrogen bond interaction between ω-carboxyl thiols decreased the defect density of the SAMs and significantly retarded the deposition of copper. The presence of bromide anions also shifted the potential more negatively through adsorption into the defects of SAMs.
|Keywords:||electrodeposition, self-assembled monolayer, specific adsorptive anion|
|Subjects:||Q Science > QD Chemistry|
|Divisions:||University Structure - Pre August 2011 > School of Engineering Sciences > Engineering Materials & Surface Engineering
|Date Deposited:||25 Sep 2008|
|Last Modified:||01 Jun 2011 07:19|
|Contributors:||Zhang, X.G. (Author)
Li, X.H. (Author)
Li, H.L. (Author)
|Date:||1 February 2001|
|Contact Email Address:||firstname.lastname@example.org|
|RDF:||RDF+N-Triples, RDF+N3, RDF+XML, Browse.|
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