Fabrication of MEMS components using ultrafine-grained aluminium alloys

Qiao, Xiao Guang, Gao, Nong, Moktadir, Zakaria, Kraft, Michael and Starink, Marco J. (2010) Fabrication of MEMS components using ultrafine-grained aluminium alloys. Journal of Micromechanics and Microengineering, 20, (4), 045029-[9pp]. (doi:10.1088/0960-1317/20/4/045029).


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A novel process for the fabrication of a microelectromechanical systems (MEMS) metallic component with features smaller than 10 µm and high thermal conductivity was investigated. These may be applied in new or improved microscale components, such as (micro-) heat exchangers. In the first stage of processing, equal channel angular pressing (ECAP) was employed to refine the grain size of commercial purity aluminium (Al-1050) to the ultra fine grain (UFG) material. Embossing was conducted using a micro silicon mould fabricated by deep reactive ion etching (DRIE). Both cold embossing and hot embossing were performed on the coarse-grained and UFG Al-1050. Cold embossing on the UFG Al-1050 led to a partially transferred pattern from the micro silicon mould and high failure rate of the mould. Hot embossing on the UFG Al-1050 provided a smooth embossed surface with fully transferred pattern and low failure rate of the mould, while hot embossing on the coarse-grained Al-1050 resulted in a rougher surface with shear bands.

Item Type: Article
Digital Object Identifier (DOI): doi:10.1088/0960-1317/20/4/045029
ISSNs: 0960-1317 (print)
1361-6439 (electronic)
Subjects: T Technology > TJ Mechanical engineering and machinery
T Technology > TN Mining engineering. Metallurgy
T Technology > TS Manufactures
Divisions: University Structure - Pre August 2011 > School of Electronics and Computer Science > Nano-Scale Integration Group
University Structure - Pre August 2011 > School of Engineering Sciences > Engineering Materials & Surface Engineering
ePrint ID: 69872
Date :
Date Event
April 2010Published
Date Deposited: 09 Dec 2009
Last Modified: 31 Mar 2016 12:58
URI: http://eprints.soton.ac.uk/id/eprint/69872

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