Multiscale mechanics modeling of direct silicon wafer bonding
Kubair, Dhirendra, Cole, Daniel J., Ciacci, Lucio C. and Spearing, Simon Mark (2009) Multiscale mechanics modeling of direct silicon wafer bonding. Scripta Materialia, 60, (12), 1125-1128. (doi:10.1016/j.scriptamat.2009.02.058).
Full text not available from this repository.
The direct bonding of macroscopically patterned silicon wafers is studied with a cohesive zone model (CZM), the form and key parameters of which are obtained from molecular dynamics simulations. The CZM is implemented in a spectral scheme. For the case of ideally flat wafer surfaces investigated here, the results are consistent with previous work in which the CZM was derived from an assumption of a continuum water film. This multiscale approach has the potential to model directly the effects of surface roughness, nanotopography and small-scale patterning on the efficacy of direct wafer bonding.
|Subjects:||T Technology > TN Mining engineering. Metallurgy|
|Divisions:||University Structure - Pre August 2011 > School of Engineering Sciences > Engineering Materials & Surface Engineering
|Date Deposited:||16 Mar 2010|
|Last Modified:||27 Mar 2014 19:01|
|RDF:||RDF+N-Triples, RDF+N3, RDF+XML, Browse.|
Actions (login required)