Kubair, Dhirendra, Cole, Daniel J., Ciacci, Lucio C. and Spearing, Simon Mark
Multiscale mechanics modeling of direct silicon wafer bonding.
Scripta Materialia, 60, (12), . (doi:10.1016/j.scriptamat.2009.02.058).
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The direct bonding of macroscopically patterned silicon wafers is studied with a cohesive zone model (CZM), the form and key parameters of which are obtained from molecular dynamics simulations. The CZM is implemented in a spectral scheme. For the case of ideally flat wafer surfaces investigated here, the results are consistent with previous work in which the CZM was derived from an assumption of a continuum water film. This multiscale approach has the potential to model directly the effects of surface roughness, nanotopography and small-scale patterning on the efficacy of direct wafer bonding.
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