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The scaling of strength in the design of high-power MEMS structures

The scaling of strength in the design of high-power MEMS structures
The scaling of strength in the design of high-power MEMS structures
The prediction of the strength of complicated structures based on material test data is important for high-power density microelectromechanical systems. Probalistic analysis is used to predict the strength of pressure-tested microfabricated silicon structures from simpler test specimens. The predictions are found to be non-conservative. This is probably due to interactions between the etching process and the structural geometry, which changes the flaw distribution between the two statistical populations. In both cases secondary smoothing etches recover the strength.
microelectromechanical systems, silicon, fracture, weakest link statistics, fractography
1359-6462
927-930
Noonan, Erin E
e863f704-a2a9-43db-8d60-5f6ed44ca5ea
Peles, Yoav
75eb6693-04ba-465b-9a48-9a27e9526cb5
Protz, Christopher S.
1cf50466-1bc1-46a9-8687-5f8f861e5875
Spearing, Simon Mark
9e56a7b3-e0e8-47b1-a6b4-db676ed3c17a
Noonan, Erin E
e863f704-a2a9-43db-8d60-5f6ed44ca5ea
Peles, Yoav
75eb6693-04ba-465b-9a48-9a27e9526cb5
Protz, Christopher S.
1cf50466-1bc1-46a9-8687-5f8f861e5875
Spearing, Simon Mark
9e56a7b3-e0e8-47b1-a6b4-db676ed3c17a

Noonan, Erin E, Peles, Yoav, Protz, Christopher S. and Spearing, Simon Mark (2008) The scaling of strength in the design of high-power MEMS structures. Scripta Materialia, 59 (9), 927-930. (doi:10.1016/j.scriptamat.2008.03.045).

Record type: Article

Abstract

The prediction of the strength of complicated structures based on material test data is important for high-power density microelectromechanical systems. Probalistic analysis is used to predict the strength of pressure-tested microfabricated silicon structures from simpler test specimens. The predictions are found to be non-conservative. This is probably due to interactions between the etching process and the structural geometry, which changes the flaw distribution between the two statistical populations. In both cases secondary smoothing etches recover the strength.

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More information

Published date: November 2008
Keywords: microelectromechanical systems, silicon, fracture, weakest link statistics, fractography
Organisations: Engineering Mats & Surface Engineerg Gp

Identifiers

Local EPrints ID: 64555
URI: http://eprints.soton.ac.uk/id/eprint/64555
ISSN: 1359-6462
PURE UUID: cdaa5950-23e2-4bed-9177-025ca0bc4590
ORCID for Simon Mark Spearing: ORCID iD orcid.org/0000-0002-3059-2014

Catalogue record

Date deposited: 23 Dec 2008
Last modified: 16 Mar 2024 03:37

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Contributors

Author: Erin E Noonan
Author: Yoav Peles
Author: Christopher S. Protz

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