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Residual stress and microstructure of as-deposited and annealed, sputtered yttria-stabilized zirconia thin films

Residual stress and microstructure of as-deposited and annealed, sputtered yttria-stabilized zirconia thin films
Residual stress and microstructure of as-deposited and annealed, sputtered yttria-stabilized zirconia thin films
The microstructure and residual stress of sputter-deposited yttria-stabilized zirconia (YSZ) films are presented as a function of thickness (5-1000 nm), deposition pressure (5-100 mTorr), and post-deposition temperature. The as-deposited residual stress of YSZ ranges from -1.4 GPa to 100 MPa with variations in sputtering conditions. Transitions from compressive to tensile stress are identified with variations in working pressure and film thickness. The origins and variations in as-deposited stress are determined to be from tensile stress due to grain coalescence/growth, and compressive stresses are due to forward sputtering/"atomic peening" of target atoms. The evolution of residual stress with post-deposition annealing shows a tensile stress hysteresis of up to 1 GPa for films deposited at low working pressures. This hysteresis is believed to be due to crystallization and the diffusive relief of compressive stresses initially generated by atomic peening during deposition. Discussion and evaluation of other common residual stress mechanisms are presented throughout.
609-618
Quinn, David J.
f6406ee6-edb1-4c6d-a243-bfff395e1638
Wardle, Brian
d0d4a5ed-ac0a-4494-aa5a-1d509df20587
Spearing, S. Mark
9e56a7b3-e0e8-47b1-a6b4-db676ed3c17a
Quinn, David J.
f6406ee6-edb1-4c6d-a243-bfff395e1638
Wardle, Brian
d0d4a5ed-ac0a-4494-aa5a-1d509df20587
Spearing, S. Mark
9e56a7b3-e0e8-47b1-a6b4-db676ed3c17a

Quinn, David J., Wardle, Brian and Spearing, S. Mark (2008) Residual stress and microstructure of as-deposited and annealed, sputtered yttria-stabilized zirconia thin films. Journal of Materials Research, 23 (3), Spring Issue, 609-618. (doi:10.1557/JMR.2008.0077).

Record type: Article

Abstract

The microstructure and residual stress of sputter-deposited yttria-stabilized zirconia (YSZ) films are presented as a function of thickness (5-1000 nm), deposition pressure (5-100 mTorr), and post-deposition temperature. The as-deposited residual stress of YSZ ranges from -1.4 GPa to 100 MPa with variations in sputtering conditions. Transitions from compressive to tensile stress are identified with variations in working pressure and film thickness. The origins and variations in as-deposited stress are determined to be from tensile stress due to grain coalescence/growth, and compressive stresses are due to forward sputtering/"atomic peening" of target atoms. The evolution of residual stress with post-deposition annealing shows a tensile stress hysteresis of up to 1 GPa for films deposited at low working pressures. This hysteresis is believed to be due to crystallization and the diffusive relief of compressive stresses initially generated by atomic peening during deposition. Discussion and evaluation of other common residual stress mechanisms are presented throughout.

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Published date: March 2008
Organisations: Engineering Mats & Surface Engineerg Gp

Identifiers

Local EPrints ID: 155231
URI: http://eprints.soton.ac.uk/id/eprint/155231
PURE UUID: c2dbe29c-74b6-4c30-92e7-051e6fa83c20
ORCID for S. Mark Spearing: ORCID iD orcid.org/0000-0002-3059-2014

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Date deposited: 27 May 2010 10:26
Last modified: 14 Mar 2024 02:49

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Contributors

Author: David J. Quinn
Author: Brian Wardle

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