Interconnected reversible lab-on-a-chip technology
Interconnected reversible lab-on-a-chip technology
Interconnected lab-on-a-chip modules with minimal dead volume have been developed resulting in the plug and play concept based upon a reversible bonding process. This paper describes the detail of a chip to chip interconnection method, where devices have been aligned and bonded within 15 min and rapidly disassembled in under 5 min. The transport of fluorescein between the chip modules was used as a model microfluidic system and analysed in order to demonstrate the electrophoretic performance of the device and the interconnected junction. Using this technology, in the future different modules for various applications can be developed and interconnected, depending on the required applications. In addition, this simple but rapid method of chip to chip connection overcomes potential problems associated with integrating incompatible materials on one device.
65-69
Igata, E.
e452f526-e1f9-43a2-b316-a970eeebf509
Arundell, M.
e24d3405-a436-4d65-a6e4-2939ede79678
Morgan, H.
de00d59f-a5a2-48c4-a99a-1d5dd7854174
Cooper, J. M.
119cf6f4-354b-4737-a52b-c2aa2143d3bd
23 April 2002
Igata, E.
e452f526-e1f9-43a2-b316-a970eeebf509
Arundell, M.
e24d3405-a436-4d65-a6e4-2939ede79678
Morgan, H.
de00d59f-a5a2-48c4-a99a-1d5dd7854174
Cooper, J. M.
119cf6f4-354b-4737-a52b-c2aa2143d3bd
Igata, E., Arundell, M., Morgan, H. and Cooper, J. M.
(2002)
Interconnected reversible lab-on-a-chip technology.
Lab on a Chip, 2 (2), .
(doi:10.1039/b200928p).
Abstract
Interconnected lab-on-a-chip modules with minimal dead volume have been developed resulting in the plug and play concept based upon a reversible bonding process. This paper describes the detail of a chip to chip interconnection method, where devices have been aligned and bonded within 15 min and rapidly disassembled in under 5 min. The transport of fluorescein between the chip modules was used as a model microfluidic system and analysed in order to demonstrate the electrophoretic performance of the device and the interconnected junction. Using this technology, in the future different modules for various applications can be developed and interconnected, depending on the required applications. In addition, this simple but rapid method of chip to chip connection overcomes potential problems associated with integrating incompatible materials on one device.
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Published date: 23 April 2002
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Local EPrints ID: 155845
URI: http://eprints.soton.ac.uk/id/eprint/155845
ISSN: 1473-0197
PURE UUID: 3b65fb32-29fe-44d0-91d9-fc267fe975e9
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Date deposited: 08 Jul 2010 11:24
Last modified: 14 Mar 2024 02:48
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Author:
E. Igata
Author:
H. Morgan
Author:
J. M. Cooper
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