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Microembossing of ultrafine grained Al: microstructural analysis and finite element modelling

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Ultra fine grained (UFG) Al-1050 processed by equal channel angular pressing (ECAP) and UFG Al-Mg-Cu-Mn processed by high pressure torsion (HPT) were embossed at both room temperature and 300 ?C, with the aim of producing micro-channels. The behaviour of Al alloys during the embossing process was analysed using finite element (FE) modelling. The cold embossing of both Al alloys is characterised by a partial pattern transfer, a large embossing force, channels with oblique sidewalls and a large failure rate of the mould. The hot embossing is characterised by straight channel sidewalls, fully transferred patterns and reduced loads which decrease the failure rate of the mould. Hot embossing of UFG Al-Mg-Cu-Mn produced by HPT shows a potential of fabrication of microelectromechanical system (MEMS) components with micro channels.

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Qiao, Xiao Guang, Bah, Mamadou T., Zhang, Jiuwen, Gao, Nong, Moktadir, Zakaria, Kraft, Michael and Starink, Marco J. (2010) Microembossing of ultrafine grained Al: microstructural analysis and finite element modelling Journal of Micromechanics and Microengineering, 20, (10), 105002-[15pp]. (doi:10.1088/0960-1317/20/10/105002).

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Submitted date: 5 March 2010
Accepted/In Press date: 19 July 2010
Published date: 1 September 2010
Organisations: Engineering Mats & Surface Engineerg Gp


Local EPrints ID: 163079
ISSN: 0960-1317
PURE UUID: b59d5651-c827-462c-83c0-f544ffe7256b

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Date deposited: 03 Sep 2010 08:02
Last modified: 24 Jul 2017 16:42

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Author: Xiao Guang Qiao
Author: Mamadou T. Bah
Author: Jiuwen Zhang
Author: Nong Gao
Author: Zakaria Moktadir
Author: Michael Kraft

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