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Electrochemistry of the SUCOPLATE® electroplating bath for the deposition of a Cu-Zn-Sn alloy - part I: commercial bath

Electrochemistry of the SUCOPLATE® electroplating bath for the deposition of a Cu-Zn-Sn alloy - part I: commercial bath
Electrochemistry of the SUCOPLATE® electroplating bath for the deposition of a Cu-Zn-Sn alloy - part I: commercial bath
The deposition of a Cu-Zn-Sn alloy from a commercial alkaline cyanide electroplating bath operated at 333 K has been investigated using voltammetric techniques and electron microscopy. It is shown that a highly reflecting alloy deposit with a composition in the range 47-51% copper, 8-12% zinc and 38-43% tin can be produced under a range of conditions. In addition, it is concluded that the rate of alloy deposition is partially limited by mass transport and partially by the kinetics of reactions in homogeneous solution.
alloy deposition, bath components, cu-zn-sn, electroplating
387-394
Picincu, L.
db45bac9-6816-4199-9b1a-4646d0551e3b
Pletcher, D.
f22ebe69-b859-4a89-80b0-9e190e6f8f30
Smith, A.
f115f8cb-6c76-444b-ba80-7a1d54276da8
Picincu, L.
db45bac9-6816-4199-9b1a-4646d0551e3b
Pletcher, D.
f22ebe69-b859-4a89-80b0-9e190e6f8f30
Smith, A.
f115f8cb-6c76-444b-ba80-7a1d54276da8

Picincu, L., Pletcher, D. and Smith, A. (2001) Electrochemistry of the SUCOPLATE® electroplating bath for the deposition of a Cu-Zn-Sn alloy - part I: commercial bath. Journal of Applied Electrochemistry, 31 (4), 387-394. (doi:10.1023/A:1017599113191).

Record type: Article

Abstract

The deposition of a Cu-Zn-Sn alloy from a commercial alkaline cyanide electroplating bath operated at 333 K has been investigated using voltammetric techniques and electron microscopy. It is shown that a highly reflecting alloy deposit with a composition in the range 47-51% copper, 8-12% zinc and 38-43% tin can be produced under a range of conditions. In addition, it is concluded that the rate of alloy deposition is partially limited by mass transport and partially by the kinetics of reactions in homogeneous solution.

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More information

Published date: 1 April 2001
Keywords: alloy deposition, bath components, cu-zn-sn, electroplating

Identifiers

Local EPrints ID: 19595
URI: http://eprints.soton.ac.uk/id/eprint/19595
PURE UUID: 7f628e30-669e-4ebf-8ff0-71abe495c03e

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Date deposited: 14 Feb 2006
Last modified: 15 Mar 2024 06:17

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Contributors

Author: L. Picincu
Author: D. Pletcher
Author: A. Smith

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