Kumar, S. and Scanlan, J.P.
On axisymmetric adhesive joints with graded interface stiffness
International Journal of Adhesion and Adhesives, 41, . (doi:10.1016/j.ijadhadh.2012.09.001).
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An improved analytical model is presented for the stress analysis of interface stiffness graded axisymmetric adhesive joints. The governing integro-differential equation of the problem is obtained through a variational method which minimizes the complementary energy of the bonded assembly. The joint is composed of similar or dissimilar polar anisotropic and/or isotropic adherends and a functionally modulus graded bondline (FMGB) adhesive. The elastic modulus of the adhesive is functionally graded along the bondlength by assuming smooth modulus profiles which reflect the behavior of practically producible graded bondline. Influence of non-zero radial stresses in the bonded system on shear and normal stresses is evaluated. The stress distribution predicted by this refined model is compared with that of mono-modulus bondline (MMB) model for the same axial tensile load in order to estimate reduction in shear and normal stress peaks in the bondline and the adherends. A systematic parametric study indicates that an optimum joint strength can be achieved by employing a stiffness graded bondline with an appropriate combination of geometrical and material properties of the adherends. This model can also be applied to examine the effects of loss of interface stiffness due to an existing defect and/or damage in the bondline
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