An evaluation of materials and processes employed in the construction of novel thick film force sensors
An evaluation of materials and processes employed in the construction of novel thick film force sensors
437-440
International Microelectronics and Packaging Society (IMAPS)
Zheng, Y.
4f14b365-2ced-4b7c-bc00-d1599153a12e
Atkinson, J.K.
5e9729b2-0e1f-400d-a889-c74f6390ea58
Sion, R.P.
b702a661-c816-44c3-8131-c9bb064d282c
Zhang, Z.
fd968521-9e43-4b50-b67e-3b6dfa095d13
2002
Zheng, Y.
4f14b365-2ced-4b7c-bc00-d1599153a12e
Atkinson, J.K.
5e9729b2-0e1f-400d-a889-c74f6390ea58
Sion, R.P.
b702a661-c816-44c3-8131-c9bb064d282c
Zhang, Z.
fd968521-9e43-4b50-b67e-3b6dfa095d13
Zheng, Y., Atkinson, J.K., Sion, R.P. and Zhang, Z.
(2002)
An evaluation of materials and processes employed in the construction of novel thick film force sensors.
In Proceedings of the 35th Annual Symposium on Microelectronics (IMPAS 2002).
International Microelectronics and Packaging Society (IMAPS).
.
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Conference or Workshop Item
(Paper)
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Published date: 2002
Additional Information:
CD-ROM
Venue - Dates:
35th Annual Symposium on Microelectronics (IMPAS 2002), Denver, USA, 2002-09-03 - 2002-09-06
Identifiers
Local EPrints ID: 22338
URI: http://eprints.soton.ac.uk/id/eprint/22338
PURE UUID: 801c1f60-8503-4eba-b699-c57163e56cc9
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Date deposited: 08 Mar 2007
Last modified: 18 Oct 2022 01:31
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Contributors
Author:
Y. Zheng
Author:
R.P. Sion
Author:
Z. Zhang
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