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An evaluation of materials and processes employed in the construction of novel thick film force sensors

An evaluation of materials and processes employed in the construction of novel thick film force sensors
An evaluation of materials and processes employed in the construction of novel thick film force sensors
437-440
International Microelectronics and Packaging Society (IMAPS)
Zheng, Y.
4f14b365-2ced-4b7c-bc00-d1599153a12e
Atkinson, J.K.
5e9729b2-0e1f-400d-a889-c74f6390ea58
Sion, R.P.
b702a661-c816-44c3-8131-c9bb064d282c
Zhang, Z.
fd968521-9e43-4b50-b67e-3b6dfa095d13
Zheng, Y.
4f14b365-2ced-4b7c-bc00-d1599153a12e
Atkinson, J.K.
5e9729b2-0e1f-400d-a889-c74f6390ea58
Sion, R.P.
b702a661-c816-44c3-8131-c9bb064d282c
Zhang, Z.
fd968521-9e43-4b50-b67e-3b6dfa095d13

Zheng, Y., Atkinson, J.K., Sion, R.P. and Zhang, Z. (2002) An evaluation of materials and processes employed in the construction of novel thick film force sensors. In Proceedings of the 35th Annual Symposium on Microelectronics (IMPAS 2002). International Microelectronics and Packaging Society (IMAPS). pp. 437-440 .

Record type: Conference or Workshop Item (Paper)

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More information

Published date: 2002
Additional Information: CD-ROM
Venue - Dates: 35th Annual Symposium on Microelectronics (IMPAS 2002), Denver, USA, 2002-09-03 - 2002-09-06

Identifiers

Local EPrints ID: 22338
URI: http://eprints.soton.ac.uk/id/eprint/22338
PURE UUID: 801c1f60-8503-4eba-b699-c57163e56cc9

Catalogue record

Date deposited: 08 Mar 2007
Last modified: 18 Oct 2022 01:31

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Contributors

Author: Y. Zheng
Author: J.K. Atkinson
Author: R.P. Sion
Author: Z. Zhang

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