A cohesive zone model for low cycle fatigue life prediction of solder joints
A cohesive zone model for low cycle fatigue life prediction of solder joints
A cohesive zone model is proposed in this paper in an effort to predict the low cycle fatigue life of solder joints plastically deformed under cyclic loading. Damage mechanics is incorporated into the cohesive law to account for the gradual loss of stiffness and strength of solder materials under cyclic loading. The damage evolution law is assumed to be a function of accumulated plastic strain. It has been demonstrated that, once the parameters of the cohesive zone model are determined via one particular cyclic test, it is then able to predict the fatigue life of solder joints made of the same materials system under different loading conditions.
cohesive zone model, fracture, fatigue life, solder joints, damage mechanics
85-95
Yang, Q.D.
599df7d4-487c-4255-aca8-d4af7beb1819
Shim, D.J.
f8257610-c0da-4fbc-812b-e4981d10ea6b
Spearing, S.M.
9e56a7b3-e0e8-47b1-a6b4-db676ed3c17a
2004
Yang, Q.D.
599df7d4-487c-4255-aca8-d4af7beb1819
Shim, D.J.
f8257610-c0da-4fbc-812b-e4981d10ea6b
Spearing, S.M.
9e56a7b3-e0e8-47b1-a6b4-db676ed3c17a
Yang, Q.D., Shim, D.J. and Spearing, S.M.
(2004)
A cohesive zone model for low cycle fatigue life prediction of solder joints.
Microelectronic Engineering, 75 (1), .
(doi:10.1016/j.mee.2003.11.009).
Abstract
A cohesive zone model is proposed in this paper in an effort to predict the low cycle fatigue life of solder joints plastically deformed under cyclic loading. Damage mechanics is incorporated into the cohesive law to account for the gradual loss of stiffness and strength of solder materials under cyclic loading. The damage evolution law is assumed to be a function of accumulated plastic strain. It has been demonstrated that, once the parameters of the cohesive zone model are determined via one particular cyclic test, it is then able to predict the fatigue life of solder joints made of the same materials system under different loading conditions.
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Published date: 2004
Additional Information:
Proceedings of the Symposium on Characterization and Mechanical Reliability of Advanced Electronic Materials at Nanoscale, 2003 ASME Mechanics and Materials Conference
Keywords:
cohesive zone model, fracture, fatigue life, solder joints, damage mechanics
Identifiers
Local EPrints ID: 22997
URI: http://eprints.soton.ac.uk/id/eprint/22997
ISSN: 0167-9317
PURE UUID: 2a41875c-d993-4202-87f0-a026f4451c47
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Date deposited: 13 Mar 2006
Last modified: 16 Mar 2024 03:37
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Contributors
Author:
Q.D. Yang
Author:
D.J. Shim
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