Soldering of mild steels: functional joints
Soldering of mild steels: functional joints
In recent years, adhesive joints have replaced numerous soldered joints, especially in applications where electrical conductivity is not required from the members of the joint. Nevertheless, soldered joints are still used in applications ranging from electronics to high-technology components. The present work seeks to demonstrate that soldered joints, which can be considered as functional joints, have very good mechanical properties and can provide more than acceptable levels of leak tightness. Hence, microstructural characterisation studies have been carried out on the filler metals used to solder mild steel, the surface preparation required to achieve the best final properties has been assessed, the joints characterised by means of radiography and the mechanical properties of the joints determined. The results obtained for soldered joints have been compared with those obtained from adhesive and hybrid joints.
Finally, scanning electron microscopy has been performed on the fracture surfaces of the soldered joint.
soldering, material tests, surface perparation, materials characterisation, joint characterisation, radiography
285-292
Molleda, F.
4c7f3ecf-929f-4975-8067-1e3d3ef36e35
Mora, J.
5c592393-b942-4024-9e6d-2ebdbae8e33a
Molleda, F.J.
5901c384-82d8-4303-a1a4-b79c7b936d1d
Carillo, E.
3fbb5776-16ba-442d-b03a-072c238c0aa6
Mellor, B.G.
2b13b80f-880b-49ac-82fe-827a15dde2fe
2003
Molleda, F.
4c7f3ecf-929f-4975-8067-1e3d3ef36e35
Mora, J.
5c592393-b942-4024-9e6d-2ebdbae8e33a
Molleda, F.J.
5901c384-82d8-4303-a1a4-b79c7b936d1d
Carillo, E.
3fbb5776-16ba-442d-b03a-072c238c0aa6
Mellor, B.G.
2b13b80f-880b-49ac-82fe-827a15dde2fe
Molleda, F., Mora, J., Molleda, F.J., Carillo, E. and Mellor, B.G.
(2003)
Soldering of mild steels: functional joints.
Materials Characterization, 51 (5), .
(doi:10.1016/j.matchar.2004.01.002).
Abstract
In recent years, adhesive joints have replaced numerous soldered joints, especially in applications where electrical conductivity is not required from the members of the joint. Nevertheless, soldered joints are still used in applications ranging from electronics to high-technology components. The present work seeks to demonstrate that soldered joints, which can be considered as functional joints, have very good mechanical properties and can provide more than acceptable levels of leak tightness. Hence, microstructural characterisation studies have been carried out on the filler metals used to solder mild steel, the surface preparation required to achieve the best final properties has been assessed, the joints characterised by means of radiography and the mechanical properties of the joints determined. The results obtained for soldered joints have been compared with those obtained from adhesive and hybrid joints.
Finally, scanning electron microscopy has been performed on the fracture surfaces of the soldered joint.
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Published date: 2003
Keywords:
soldering, material tests, surface perparation, materials characterisation, joint characterisation, radiography
Identifiers
Local EPrints ID: 23039
URI: http://eprints.soton.ac.uk/id/eprint/23039
ISSN: 1044-5803
PURE UUID: 197c1afc-26d4-4cd5-b841-fea6b88e745e
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Date deposited: 24 Mar 2006
Last modified: 15 Mar 2024 06:43
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Contributors
Author:
F. Molleda
Author:
J. Mora
Author:
F.J. Molleda
Author:
E. Carillo
Author:
B.G. Mellor
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