The University of Southampton
University of Southampton Institutional Repository

Soldering of mild steels: functional joints

Soldering of mild steels: functional joints
Soldering of mild steels: functional joints
In recent years, adhesive joints have replaced numerous soldered joints, especially in applications where electrical conductivity is not required from the members of the joint. Nevertheless, soldered joints are still used in applications ranging from electronics to high-technology components. The present work seeks to demonstrate that soldered joints, which can be considered as functional joints, have very good mechanical properties and can provide more than acceptable levels of leak tightness. Hence, microstructural characterisation studies have been carried out on the filler metals used to solder mild steel, the surface preparation required to achieve the best final properties has been assessed, the joints characterised by means of radiography and the mechanical properties of the joints determined. The results obtained for soldered joints have been compared with those obtained from adhesive and hybrid joints.

Finally, scanning electron microscopy has been performed on the fracture surfaces of the soldered joint.
soldering, material tests, surface perparation, materials characterisation, joint characterisation, radiography
1044-5803
285-292
Molleda, F.
4c7f3ecf-929f-4975-8067-1e3d3ef36e35
Mora, J.
5c592393-b942-4024-9e6d-2ebdbae8e33a
Molleda, F.J.
5901c384-82d8-4303-a1a4-b79c7b936d1d
Carillo, E.
3fbb5776-16ba-442d-b03a-072c238c0aa6
Mellor, B.G.
2b13b80f-880b-49ac-82fe-827a15dde2fe
Molleda, F.
4c7f3ecf-929f-4975-8067-1e3d3ef36e35
Mora, J.
5c592393-b942-4024-9e6d-2ebdbae8e33a
Molleda, F.J.
5901c384-82d8-4303-a1a4-b79c7b936d1d
Carillo, E.
3fbb5776-16ba-442d-b03a-072c238c0aa6
Mellor, B.G.
2b13b80f-880b-49ac-82fe-827a15dde2fe

Molleda, F., Mora, J., Molleda, F.J., Carillo, E. and Mellor, B.G. (2003) Soldering of mild steels: functional joints. Materials Characterization, 51 (5), 285-292. (doi:10.1016/j.matchar.2004.01.002).

Record type: Article

Abstract

In recent years, adhesive joints have replaced numerous soldered joints, especially in applications where electrical conductivity is not required from the members of the joint. Nevertheless, soldered joints are still used in applications ranging from electronics to high-technology components. The present work seeks to demonstrate that soldered joints, which can be considered as functional joints, have very good mechanical properties and can provide more than acceptable levels of leak tightness. Hence, microstructural characterisation studies have been carried out on the filler metals used to solder mild steel, the surface preparation required to achieve the best final properties has been assessed, the joints characterised by means of radiography and the mechanical properties of the joints determined. The results obtained for soldered joints have been compared with those obtained from adhesive and hybrid joints.

Finally, scanning electron microscopy has been performed on the fracture surfaces of the soldered joint.

This record has no associated files available for download.

More information

Published date: 2003
Keywords: soldering, material tests, surface perparation, materials characterisation, joint characterisation, radiography

Identifiers

Local EPrints ID: 23039
URI: http://eprints.soton.ac.uk/id/eprint/23039
ISSN: 1044-5803
PURE UUID: 197c1afc-26d4-4cd5-b841-fea6b88e745e

Catalogue record

Date deposited: 24 Mar 2006
Last modified: 15 Mar 2024 06:43

Export record

Altmetrics

Contributors

Author: F. Molleda
Author: J. Mora
Author: F.J. Molleda
Author: E. Carillo
Author: B.G. Mellor

Download statistics

Downloads from ePrints over the past year. Other digital versions may also be available to download e.g. from the publisher's website.

View more statistics

Atom RSS 1.0 RSS 2.0

Contact ePrints Soton: eprints@soton.ac.uk

ePrints Soton supports OAI 2.0 with a base URL of http://eprints.soton.ac.uk/cgi/oai2

This repository has been built using EPrints software, developed at the University of Southampton, but available to everyone to use.

We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we will assume that you are happy to receive cookies on the University of Southampton website.

×