The University of Southampton
University of Southampton Institutional Repository

Measurement of work of adhesion on wafers for direct bonding

Measurement of work of adhesion on wafers for direct bonding
Measurement of work of adhesion on wafers for direct bonding
The displacement loaded double cantilever beam (DCB), often referred to as the blade-insertion test or crack-opening method by the wafer bonding community, has become a common method for evaluating the work of adhesion of bonded wafer pairs. The test, while easy to perform, often yields results with large scatter and questionable accuracy. The mechanics of the specimen are investigated in detail in the current work. Expressions that demonstrate how wafer bow may lead to residual stresses that result in large errors in the calculated work of adhesion are developed. A three-dimensional finite element model is used to show that due to the circular wafer geometry and silicon anisotropy there is a large variation of the strain energy release rate across a straight crack front. The model is used to predict the actual crack front shape and shows good agreement with experiments. The results of the finite element simulations are compared to the traditional expression used for data reduction and implications of the model highlighted.
463-468
Materials Research Society
Turner, K.T.
a2157f89-3a3c-4712-977f-a42723316d36
Spearing, S.M.
9e56a7b3-e0e8-47b1-a6b4-db676ed3c17a
LaVan, David A.
Ayon, Arturo A.
Madou, Mark J.
McNie, Mark E.
Prasad, Samouri V.
Turner, K.T.
a2157f89-3a3c-4712-977f-a42723316d36
Spearing, S.M.
9e56a7b3-e0e8-47b1-a6b4-db676ed3c17a
LaVan, David A.
Ayon, Arturo A.
Madou, Mark J.
McNie, Mark E.
Prasad, Samouri V.

Turner, K.T. and Spearing, S.M. (2004) Measurement of work of adhesion on wafers for direct bonding. LaVan, David A., Ayon, Arturo A., Madou, Mark J., McNie, Mark E. and Prasad, Samouri V. (eds.) In Materials Research Society Symposium Proceedings: Micro- and Nanosystems. Materials Research Society. pp. 463-468 .

Record type: Conference or Workshop Item (Paper)

Abstract

The displacement loaded double cantilever beam (DCB), often referred to as the blade-insertion test or crack-opening method by the wafer bonding community, has become a common method for evaluating the work of adhesion of bonded wafer pairs. The test, while easy to perform, often yields results with large scatter and questionable accuracy. The mechanics of the specimen are investigated in detail in the current work. Expressions that demonstrate how wafer bow may lead to residual stresses that result in large errors in the calculated work of adhesion are developed. A three-dimensional finite element model is used to show that due to the circular wafer geometry and silicon anisotropy there is a large variation of the strain energy release rate across a straight crack front. The model is used to predict the actual crack front shape and shows good agreement with experiments. The results of the finite element simulations are compared to the traditional expression used for data reduction and implications of the model highlighted.

This record has no associated files available for download.

More information

Published date: 2004
Additional Information: Symposium A

Identifiers

Local EPrints ID: 23274
URI: http://eprints.soton.ac.uk/id/eprint/23274
PURE UUID: 7ce6ca2d-c764-436d-a097-8bbe36854642
ORCID for S.M. Spearing: ORCID iD orcid.org/0000-0002-3059-2014

Catalogue record

Date deposited: 14 Mar 2006
Last modified: 08 Jan 2022 02:59

Export record

Contributors

Author: K.T. Turner
Author: S.M. Spearing ORCID iD
Editor: David A. LaVan
Editor: Arturo A. Ayon
Editor: Mark J. Madou
Editor: Mark E. McNie
Editor: Samouri V. Prasad

Download statistics

Downloads from ePrints over the past year. Other digital versions may also be available to download e.g. from the publisher's website.

View more statistics

Atom RSS 1.0 RSS 2.0

Contact ePrints Soton: eprints@soton.ac.uk

ePrints Soton supports OAI 2.0 with a base URL of http://eprints.soton.ac.uk/cgi/oai2

This repository has been built using EPrints software, developed at the University of Southampton, but available to everyone to use.

We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we will assume that you are happy to receive cookies on the University of Southampton website.

×